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IS43R16160A Datasheet(PDF) 1 Page - Integrated Silicon Solution, Inc

Part # IS43R16160A
Description  16Meg x 16 256-MBIT DDR SDRAM
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Manufacturer  ISSI [Integrated Silicon Solution, Inc]
Direct Link  http://www.issi.com
Logo ISSI - Integrated Silicon Solution, Inc

IS43R16160A Datasheet(HTML) 1 Page - Integrated Silicon Solution, Inc

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Integrated Silicon Solution, Inc. — 1-800-379-4774
1
Rev. 00B
11/28/05
ISSI®
IS43R16160A
Copyright © 2005 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
FEATURES
Clock Frequency: 200, 166 MHz
Power supply (VDD and VDDQ)
DDR 333: 2.5V + 0.2V
DDR 400: 2.6V + 0.1V
SSTL 2 interface
Four internal banks to hide row Pre-charge
and Active operations
Commands and addresses register on positive
clock edges (CK)
Bi-directional Data Strobe signal for data cap-
ture
Differential clock inputs (CK and CK) for
two data accesses per clock cycle
Data Mask feature for Writes supported
DLL aligns data I/O and Data Strobe transitions
with clock inputs
Half-strength and Full-strength drive strength
options
Programmable burst length for Read and Write
operations
Programmable CAS Latency (2, 2.5, or 3
clocks)
Programmable burst sequence: sequential or
interleaved
Burst concatenation and truncation supported
for maximum data throughput
Auto Pre-charge option for each Read or Write
burst
8192 refresh cycles every 64ms
Auto Refresh and Self Refresh Modes
Pre-charge Power Down and Active Power
Down Modes
Lead-free available
16Meg x 16
256-MBIT DDR SDRAM
PRELIMINARY INFORMATION
NOVEMBER 2005
DEVICE OVERVIEW
ISSI’s 256-Mbit DDR SDRAM achieves high-speed data
transfer using pipeline architecture and two data word
accesses per clock cycle. The 268,435,456-bit memory
array is internally organized as four banks of 64M-bit to
allow concurrent operations. The pipeline allows Read
and Write burst accesses to be virtually continuous, with
the option to concatenate or truncate the bursts. The
programmable features of burst length, burst sequence
and CAS latency enable further advantages. The device
is available in 16-bit data word size. Input data is regis-
tered on the I/O pins on both edges of Data Strobe
signal(s), while output data is referenced to both edges of
Data Strobe and both edges of CK. Commands are
registered on the positive edges of CK. Auto Refresh,
Active Power Down, and Pre-charge Power Down modes
are enabled by using clock enable (CKE) and other
inputs in an industry-standard sequence. All input and
output voltage levels are compatible with SSTL 2.
KEY TIMING PARAMETERS
Parameter
-5
-6
Unit
DDR400
DDR333
Clock Cycle Time
CAS Latency = 3
5
6
ns
CAS Latency = 2.5
6
6
ns
CAS Latency = 2
7.5
7.5
ns
Clock Frequency
CAS Latency = 3
200
166
MHz
CAS Latency = 2.5
166
166
MHz
CAS Latency = 2
133
133
MHz


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