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ZMD31010 Datasheet(PDF) 3 Page - Zentrum Mikroelektronik Dresden AG

Part No. ZMD31010
Description  RBicLite Low-Cost Sensor Signal Conditioner
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Maker  ZMD [Zentrum Mikroelektronik Dresden AG]
Homepage  http://www.zmdi.com
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RBicLite™ Datasheet, Rev. 1.2, February 28, 2006
Page 3 of 38
© ZMD AG, 2006
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31010
RBicLite
TM Low-Cost Sensor Signal Conditioner
Datasheet
4
ESD/LATCH-UP-PROTECTION ............................................................................................................... 29
5
PIN CONFIGURATION AND PACKAGE .................................................................................................. 30
6
IC CHARACTERISTICS............................................................................................................................ 31
6.1
ABSOLUTE MAXIMUM RATINGS ................................................................................................................................31
6.2
RECOMMENDED OPERATING CONDITIONS.................................................................................................................31
6.3
ELECTRICAL PARAMETERS ......................................................................................................................................32
6.4
ANALOG INPUTS.....................................................................................................................................................33
6.5
TEMPERATURE COMPENSATION AND TEMPERATURE OUTPUT .....................................................................................34
6.6
HIGH VOLTAGE OPERATION ....................................................................................................................................35
7
DIE DIMENSIONS AND PAD COORDINATES ........................................................................................ 36
7.1
DIE DIMENSIONS ....................................................................................................................................................36
7.2
PAD COORDINATES ................................................................................................................................................37
8
TEST ......................................................................................................................................................... 37
9
RELIABILITY ............................................................................................................................................. 37
10
CUSTOMIZATION..................................................................................................................................... 37
11
RELATED DOCUMENTS.......................................................................................................................... 38




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