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74ALVCH162827DGG Datasheet(PDF) 2 Page - NXP Semiconductors

Part # 74ALVCH162827DGG
Description  20-bit buffer/line driver, non-inverting,with 30ohm termination resistors (3-State)
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

74ALVCH162827DGG Datasheet(HTML) 2 Page - NXP Semiconductors

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Philips Semiconductors
Product specification
74ALVCH162827
20-bit buffer/line driver, non-inverting, with 30
termination resistors (3-State)
2
1998 Sep 29
853-2127 20100
FEATURES
Complies with JEDEC standard no. 8-1A.
CMOS low power consumption
Direct interface with TTL levels
Current drive ± 12 mA at 3.0 V
MULTIBYTETM flow-through standard pin-out architecture
Low inductance multiple V
CC and GND pins for minimum noise
and ground bounce
Integrated 30 W termination resistors
DESCRIPTION
The 74ALVCH162827 high-performance CMOS device combines
low static and dynamic power dissipation with high speed and high
output drive.
The 74ALVCH162827 20-bit buffers provide high performance bus
interface buffering for wide data/address paths or buses carrying
parity. They have NAND Output Enables (nOE1, nOE2) for
maximum control flexibility.
The 74ALVCH162827 is designed with 30
Ω series resistance in both
the pull-up and pull-down output structures. This design reduces line
noise in applications such as memory address drivers, clock drivers
and bus receivers/transmitters.
To ensure the high impedance state during power up or power
down, OE should be tied to VCC through a pullup resistor; the
minimum value of the resistor is determined by the
current-sinking/current-sourcing capability of the driver.
Active bus-hold circuitry is provided to hold unused or floating data
inputs at a valid logic level.
QUICK REFERENCE DATA
GND = 0V; Tamb = 25°C; tr = tf = 2.5ns
SYMBOL
PARAMETER
CONDITIONS
TYPICAL
UNIT
tPHL/tPLH
Propagation delay
nAn to nYn
VCC = 2.5V, CL = 30pF
VCC = 3.3V, CL = 50pF
2.9
2.9
ns
CI
Input capacitance
5
pF
CPD
Power dissipation capacitance per latch
VI = GND to VCC1
Output enabled
14
pF
CPD
Power dissi ation ca acitance er latch
VI = GND to VCC1
Output disabled
3
F
NOTES:
1.
CPD is used to determine the dynamic power dissipation (PD in mW):
PD = CPD × VCC2 × fi + S (CL × VCC2 × fo) where:
fi = input frequency in MHz; CL = output load capacity in pF;
fo = output frequency in MHz; VCC = supply voltage in V;
S (CL × VCC2 × fo) = sum of outputs.
ORDERING INFORMATION
PACKAGES
TEMPERATURE RANGE
OUTSIDE NORTH AMERICA
NORTH AMERICA
DWG NUMBER
56-Pin Plastic TSSOP Type II
–40
°C to +85°C
74ALVCH162827DGG
ACH162827DGG
SOT364-1
PIN DESCRIPTION
PIN NUMBER
SYMBOL
FUNCTION
55, 54, 52, 51, 49, 48, 47, 45, 44, 43,
42, 41, 40, 38, 37, 36, 34, 33, 31, 30
1A0 - 1A9
2A0 - 2A9
Data inputs
2, 3, 5, 6, 8, 9, 10, 12, 13, 14,
15, 16, 17, 19, 20, 21, 23, 24, 26, 27
1Y0 - 1Y9
2Y0 - 2Y9
Data outputs
1, 56,
28, 29
1OE1 1OE2,
2OE1, 2OE2
Output enable inputs (active-LOW)
4, 11, 18, 25, 32, 39, 46, 53
GND
Ground (0V)
7, 22, 35, 50
VCC
Positive supply voltage


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