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74ALVCH162827DGG Datasheet(PDF) 2 Page - NXP Semiconductors |
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74ALVCH162827DGG Datasheet(HTML) 2 Page - NXP Semiconductors |
2 / 10 page Philips Semiconductors Product specification 74ALVCH162827 20-bit buffer/line driver, non-inverting, with 30 Ω termination resistors (3-State) 2 1998 Sep 29 853-2127 20100 FEATURES • Complies with JEDEC standard no. 8-1A. • CMOS low power consumption • Direct interface with TTL levels • Current drive ± 12 mA at 3.0 V • MULTIBYTETM flow-through standard pin-out architecture • Low inductance multiple V CC and GND pins for minimum noise and ground bounce • Integrated 30 W termination resistors DESCRIPTION The 74ALVCH162827 high-performance CMOS device combines low static and dynamic power dissipation with high speed and high output drive. The 74ALVCH162827 20-bit buffers provide high performance bus interface buffering for wide data/address paths or buses carrying parity. They have NAND Output Enables (nOE1, nOE2) for maximum control flexibility. The 74ALVCH162827 is designed with 30 Ω series resistance in both the pull-up and pull-down output structures. This design reduces line noise in applications such as memory address drivers, clock drivers and bus receivers/transmitters. To ensure the high impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. QUICK REFERENCE DATA GND = 0V; Tamb = 25°C; tr = tf = 2.5ns SYMBOL PARAMETER CONDITIONS TYPICAL UNIT tPHL/tPLH Propagation delay nAn to nYn VCC = 2.5V, CL = 30pF VCC = 3.3V, CL = 50pF 2.9 2.9 ns CI Input capacitance 5 pF CPD Power dissipation capacitance per latch VI = GND to VCC1 Output enabled 14 pF CPD Power dissi ation ca acitance er latch VI = GND to VCC1 Output disabled 3 F NOTES: 1. CPD is used to determine the dynamic power dissipation (PD in mW): PD = CPD × VCC2 × fi + S (CL × VCC2 × fo) where: fi = input frequency in MHz; CL = output load capacity in pF; fo = output frequency in MHz; VCC = supply voltage in V; S (CL × VCC2 × fo) = sum of outputs. ORDERING INFORMATION PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER 56-Pin Plastic TSSOP Type II –40 °C to +85°C 74ALVCH162827DGG ACH162827DGG SOT364-1 PIN DESCRIPTION PIN NUMBER SYMBOL FUNCTION 55, 54, 52, 51, 49, 48, 47, 45, 44, 43, 42, 41, 40, 38, 37, 36, 34, 33, 31, 30 1A0 - 1A9 2A0 - 2A9 Data inputs 2, 3, 5, 6, 8, 9, 10, 12, 13, 14, 15, 16, 17, 19, 20, 21, 23, 24, 26, 27 1Y0 - 1Y9 2Y0 - 2Y9 Data outputs 1, 56, 28, 29 1OE1 1OE2, 2OE1, 2OE2 Output enable inputs (active-LOW) 4, 11, 18, 25, 32, 39, 46, 53 GND Ground (0V) 7, 22, 35, 50 VCC Positive supply voltage |
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