www.ti.com

FEATURES

1

2

3

4

5

6

1Y

V

CC

2Y

2A

GND

1A

DBV PACKAGE

(TOP VIEW)

1

2

3

4

5

6

1Y

V

CC

2Y

2A

GND

1A

DCK PACKAGE

(TOP VIEW)

1

2

3

4

5

6

1Y

V

CC

2Y

2A

GND

1A

DRL PACKAGE

(TOP VIEW)

1

2

3

4

5

6

1Y

V

CC

2Y

2A

GND

1A

YEP PACKAGE

(BOTTOM VIEW)

DESCRIPTION/ORDERING INFORMATION

SN74AUC2G34

DUAL BUFFER GATE

SCES514A – NOVEMBER 2003 – REVISED MARCH 2006

•

Available in the Texas Instruments

•

±8-mA Output Drive at 1.8 V

NanoStar™ and NanoFree™ Packages

•

Latch-Up Performance Exceeds 100 mA Per

•

Optimized for 1.8-V Operation and Is 3.6-V I/O

JESD 78, Class II

Tolerant to Support Mixed-Mode Signal

•

ESD Protection Exceeds JESD 22

Operation

– 2000-V Human-Body Model (A114-A)

•

I

– 200-V Machine Model (A115-A)

Operation

– 1000-V Charged-Device Model (C101)

•

Sub-1-V Operable

•

Max t

•

Low Power Consumption, 10

µA at 1.8 V

operation.

The SN74AUC2G34 performs the Boolean function Y = A in positive logic.

NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoStar™ – WCSP (DSBGA)

SN74AUC2G34YEPR

0.23-mm Large Bump – YEP

Tape and reel

_ _ _U9_

NanoFree™ – WCSP (DSBGA)

SN74AUC2G34YZPR

0.23-mm Large Bump – YZP (Pb-free)

–40°C to 85°C

SOT-563 – DRL

Tape and reel

SN74AUC2G34DRLR

U9_

SOT-23 – DBV

Tape and reel

SN74AUC2G34DBVR

U34_

SC-70 – DCK

Tape and reel

SN74AUC2G34DCKR

U9_

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.

YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar, NanoFree are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2003–2006, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.