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HMC451 Datasheet(PDF) 5 Page - Hittite Microwave Corporation |
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HMC451 Datasheet(HTML) 5 Page - Hittite Microwave Corporation |
5 / 8 page 1 1 - 82 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Pad Descriptions Pad Number Function Description Interface Schematic 1RF IN This pad is AC coupled and matched to 50 Ohms from 5 - 20 GHz. 2, 3 Vdd1, Vdd2 Power Supply Voltage for the amplifier. External bypass capacitors of 100 pF and 0.1 μF are required. 4 RF OUT This pad is AC coupled and matched to 50 Ohms from 5 - 20 GHz. Outline Drawing NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM] 2. DIE THICKNESS IS .004” 3. TYPICAL BOND PAD IS .004” SQUARE 4. BACKSIDE METALLIZATION: GOLD 5. BOND PAD METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 8. OVERALL DIE SIZE ± .002 Die Packaging Information [1] Standard Alternate GP-2 [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. HMC451 v00.0305 GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 5.0 - 20.0 GHz |
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