HUN2130 datasheet(5/5 Pages) HSMC

Part #	HUN2130

Description	PNP Silicon Surface Mount Transistors with Monolithic Bias Resistor Network

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Manufacturer	HSMC [Hi-Sincerity Mocroelectronics]

Direct Link	http://www.hsmc.com.tw

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HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HN200301

Issued Date : 2003.03.01

Revised Date : 2005.01.14

Page No. : 5/5

HUN21XX Series

HSMC Product Specification

Soldering Methods for HSMC’s Products

1. Storage environment: Temperature=10

oC~35oC Humidity=65%±15%

2. Reflow soldering of surface-mount devices

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Average ramp-up rate (T

L to TP)<3

oC/sec

<3

oC/sec

Preheat

- Temperature Min (Ts

min)

- Temperature Max (Ts

max)

- Time (min to max) (ts)

100

oC

150

oC

60~120 sec

150

oC

200

oC

60~180 sec

Tsmax to T

L

- Ramp-up Rate

<3

oC/sec

<3

oC/sec

Time maintained above:

- Temperature (T

L)

- Time (t

L)

183

oC

60~150 sec

217

oC

60~150 sec

Peak Temperature (T

P)

240

oC +0/-5oC

260

oC +0/-5oC

Time within 5

oC of actual Peak

Temperature (t

P)

10~30 sec

20~40 sec

Ramp-down Rate

<6

oC/sec

<6

oC/sec

Time 25

oC to Peak Temperature

<6 minutes

<8 minutes

3. Flow (wave) soldering (solder dipping)

Products

Peak temperature

Dipping time

Pb devices.

245

oC

±5oC

5sec

±1sec

Pb-Free devices.

260

oC +0/-5oC

5sec

±1sec

Figure 1: Temperature profile

tP

tL

Ramp-down

Ramp-up

Tsmax

Tsmin

Critical Zone

TL to TP

tS

Preheat

TL

TP

25

t 25oC to Peak

Time

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HUN2130 Datasheet(PDF) 5 Page - Hi-Sincerity Mocroelectronics

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