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H7812BI Datasheet(PDF) 11 Page - Hi-Sincerity Mocroelectronics |
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H7812BI Datasheet(HTML) 11 Page - Hi-Sincerity Mocroelectronics |
11 / 12 page HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : IC200405 Issued Date : 2004.04.01 Revised Date : 2006.01.19 Page No. : 11/12 H78XXAJ / BJ, H78XXAI / BI, H78XXANE / BNE, H78XXAE / BE HSMC Product Specification SOT-82 Dimension TO-220AB Dimension Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 B A C D E F G J H I K a1 12 3 a1 r3 L a1 a1 M N r1 r2 A B E G I K M O P 3 2 1 C N H D Tab F J L 3-Lead SOT-82 Plastic Package HSMC Package Code: NE Marking: HN E Pb Free Mark Pb-Free: " . " (Note) Normal: None 78 Product Series (05,06,08,09,12) Control Code Date Code Note: Green label is used for pb-free packing Pin Style: 1.Input 2.Ground 3.Output Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM Min. Max. A 7.57 7.67 B 5.44 5.54 C 3.78 3.98 D 10.88 10.98 E 10.25 10.75 F- *1.27 G- *0.76 H 1.16 1.26 I- *0.76 J 4.52 4.62 K 2.49 2.59 L 1.10 1.20 M- *0.60 N 1.22 1.32 a1 - *3o r1 - φ3.10 r2 - R1.70 r3 - R0.20 *: Typical, Unit: mm Marking: Control Code Date Code HE 78 Pb Free Mark Pb-Free: " . " (Note) Normal: None Product Series (05,06,08,09,12) Note: Green label is used for pb-free packing Pin Style: 1.Input 2.Ground 3.Output Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 3-Lead TO-220AB Plastic Package HSMC Package Code: E DIM Min. Max. A 5.58 7.49 B 8.38 8.90 C 4.40 4.70 D 1.15 1.39 E 0.35 0.60 F 2.03 2.92 G 9.66 10.28 H - *16.25 I- *3.83 J 3.00 4.00 K 0.75 0.95 L 2.54 3.42 M 1.14 1.40 N- *2.54 O 12.70 14.27 P 14.48 15.87 *: Typical, Unit: mm |
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