HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : IC200405

Issued Date : 2004.04.01

Revised Date : 2006.01.19

Page No. : 11/12

H78XXAJ / BJ, H78XXAI / BI, H78XXANE / BNE, H78XXAE / BE

HSMC Product Specification

SOT-82 Dimension

TO-220AB Dimension

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454

• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

Tel: 886-3-5983621~5 Fax: 886-3-5982931

B

A

C

D

E

F

G

J

H

I

K

a1

12

3

a1

r3

L

a1

a1

M

N

r1

r2

A

B

E

G

I

K

M

O

P

3

2

1

C

N

H

D

Tab

F

J

L

3-Lead SOT-82

Plastic Package

HSMC Package Code: NE

Marking:

HN E

Pb Free Mark

Pb-Free: "

Normal: None

78

Product Series

(05,06,08,09,12)

Control Code

Date Code

Note: Green label is used for pb-free packing

Pin Style: 1.Input 2.Ground 3.Output

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

DIM

Min.

Max.

A

7.57

7.67

B

5.44

5.54

C

3.78

3.98

D

10.88

10.98

E

10.25

10.75

F-

*1.27

G-

*0.76

H

1.16

1.26

I-

*0.76

J

4.52

4.62

K

2.49

2.59

L

1.10

1.20

M-

*0.60

N

1.22

1.32

a1

-

r1

-

φ3.10

r2

-

R1.70

r3

-

R0.20

*: Typical, Unit: mm

Marking:

Control Code

Date Code

HE

78

Pb Free Mark

Pb-Free: "

Normal: None

Product Series

(05,06,08,09,12)

Note: Green label is used for pb-free packing

Pin Style: 1.Input 2.Ground 3.Output

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

3-Lead TO-220AB

Plastic Package

HSMC Package Code: E

DIM

Min.

Max.

A

5.58

7.49

B

8.38

8.90

C

4.40

4.70

D

1.15

1.39

E

0.35

0.60

F

2.03

2.92

G

9.66

10.28

H

-

*16.25

I-

*3.83

J

3.00

4.00

K

0.75

0.95

L

2.54

3.42

M

1.14

1.40

N-

*2.54

O

12.70

14.27

P

14.48

15.87

*: Typical, Unit: mm