RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the following recommended conditions. For soldering methods and

conditions other than those recommended below, contact your nearby sales office.

6

Preliminary Data Sheet

HS350

Peak temperature

pin temperature

:350

or below

Soldering time

per side of device

: 3 seconds or less

Maximum chlorine content of rosin flux

mass

:0.2

Wt.

or below

Partial Heating

WS260

Peak temperature

molten solder temperature

: 260

or below

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Preheating temperature

package surface temperature

: 120

or below

Maximum number of reflow processes

: 1 time

Maximum chlorine content of rosin flux

mass

:0.2

Wt.

or below

Wave soldering

VP215

Peak temperature

package surface temperature

:215

or below

Time at temperature of 200

or higher

: 25 to 40 seconds

Preheating time at 120 to 150

: 30 to 60 seconds

Maximum number of reflow processes

: 3 times

Maximum chlorine content of rosin flux

mass

:0.2

Wt.

or below

VPS

IR260

Peak temperature

package surface temperature

:260

or below

Time at peak temperature

: 10 seconds or less

Time at temperature of 220

or higher

: 60 seconds or less

Preheating time at 120 to 180

: 120

30 seconds

Maximum number of reflow processes

: 3 times

Maximum chlorine content of rosin flux

mass

:0.2

Wt.

or below

Infrared Reflow

Condition Symbol

Soldering Conditions

Soldering Method

Caution Do not use different soldering methods together

except for partial heating

.

uPD5713TK