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BGY136 Datasheet(PDF) 8 Page - NXP Semiconductors |
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BGY136 Datasheet(HTML) 8 Page - NXP Semiconductors |
8 / 10 page 1996 May 08 8 Philips Semiconductors Product specification VHF power amplifier modules BGY135; BGY136 List of components (see Fig.13) Note 1. The striplines are on a double copper-clad printed-circuit board, with epoxy dielectric ( ε r = 4.7), thickness 1 ⁄ 16 inch. COMPONENT DESCRIPTION VALUE CATALOGUE NO C1, C5 multilayer chip capacitor 1 nF 4822 590 06614 C2, C6 tantalum capacitor 6.8 µF, 35 V 2022 001 00067 C3, C7 multilayer chip capacitor 10 nF 2222 852 47103 C4, C8 multilayer chip capacitor 100 nF 2222 852 47104 L1, L2 1 turn 0.5 mm copper wire on ferrite coil 1 µH 3122 108 20153 Z1, Z2 stripline; note 1 50 Ω |
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