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NCV8506D2T25 Datasheet(PDF) 10 Page - ON Semiconductor

Part # NCV8506D2T25
Description  Micropower 400 mA LDO Linear Regulators with DELAY and RESET
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCV8506D2T25 Datasheet(HTML) 10 Page - ON Semiconductor

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10
The value for the output capacitor COUT shown in Figure 15
should work for most applications, however it is not
necessarily the optimized solution.
Figure 15. Test and Application Circuit Showing
Output Compensation
VIN
VOUT
COUT**
33
µF
RRST
RESET
CIN*
0.1
µF
NCV8506
*CIN required if regulator is located far from the power supply
filter.
**COUT required for stability. Capacitor must operate at minimum
temperature expected.
CALCULATING POWER DISSIPATION IN A
SINGLE OUTPUT LINEAR REGULATOR
The maximum power dissipation for a single output
regulator (Figure 16) is:
PD(max) + [VIN(max) * VOUT(min)]IOUT(max)
(1)
) VIN(max)IQ
where:
VIN(max) is the maximum input voltage,
VOUT(min) is the minimum output voltage,
IOUT(max) is the maximum output current for the
application, and
IQ is the quiescent current the regulator consumes at
IOUT(max).
Once the value of PD(max) is known, the maximum
permissible value of RqJA can be calculated:
R
qJA +
150
°C * TA
PD
(2)
The value of RqJA can then be compared with those in the
package section of the data sheet. Those packages with
RqJA’s less than the calculated value in equation 2 will keep
the die temperature below 150
°C.
In some cases, none of the packages will be sufficient to
dissipate the heat generated by the IC, and an external
heatsink will be required.
SMART
REGULATOR
®
IQ
Control
Features
IOUT
IIN
Figure 16. Single Output Regulator with Key
Performance Parameters Labeled
VIN
VOUT
}
HEAT SINKS
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
determine the value of RqJA:
R
qJA + RqJC ) RqCS ) RqSA
(3)
where:
RqJC = the junction−to−case thermal resistance,
RqCS = the case−to−heatsink thermal resistance, and
RqSA = the heatsink−to−ambient thermal resistance.
RqJC appears in the package section of the data sheet. Like
RqJA, it too is a function of package type. RqCS and RqSA are
functions of the package type, heatsink and the interface
between them. These values appear in heat sink data sheets
of heat sink manufacturers.


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