Copyright  ANPEC Electronics Corp.

Rev. B.1 - Mar., 2005

www.anpec.com.tw

11

APM4538K

Terminal Material

Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn

Lead Solderability

Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

t 25 C to P e ak

tp

Ram p-u p

t

L

Ram p-d ow n

ts

P rehea t

Tsm ax

Tsm in

T

L

T

P

25

Tim e

C ritical Z one

T

L

to T

P

°

Classificatin Reflow Profiles

Physical Specifications

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Average ramp-up rate

3

°C/second max.

3

°C/second max.

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (min to max) (ts)

100

°C

150

°C

60-120 seconds

150

°C

200

°C

60-180 seconds

Time maintained above:

183

°C

60-150 seconds

217

°C

60-150 seconds

Peak/Classificatioon Temperature (Tp)

See table 1

See table 2

Time within 5

°C of actual

Peak Temperature (tp)

10-30 seconds

20-40 seconds

Ramp-down Rate

6

°C/second max.

6

°C/second max.

Time 25

°C to Peak Temperature

6 minutes max.

8 minutes max.

Notes: All temperatures refer to topside of the package .Measured on the body surface.