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PRELIMINARY
CY2SSTU877
Document #: 38-07575 Rev. *B
Page 8 of 9
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Package Drawing
All product and company names mentioned in this document are the trademarks of their respective holders.
A
1
A1 CORNER
0.65
Ø0.30±0.05(52X)
Ø0.25 M C A B
Ø0.05 M C
B
A
0.15(4X)
C
SEATING PLANE
A1 CORNER
TOP VIEW
BOTTOM VIEW
2
3
4
3.25
B
C
D
E
F
G
H
65
46
5
23
1
4.50±0.10
A
4.50±0.10
B
1.625
J
K
K
J
H
E
G
F
D
C
B
A
REFERENCE JEDEC MO-225
DIMENSION IN MM
51-85192-**
52 VFBGA 4.5 × 7.0 × 1.0 MM BV52A
0.60[0.024]
5.70[0.224]
5.90[0.232]
A
C
1.00[0.039] MAX.
N
SEATING
PLANE
N
2
0.18[0.007]
0.50[0.020]
1
1
0.08[0.003]
0.50[0.020]
0.05[0.002] MAX.
2
(4X)
C
0.24[0.009]
0.20[0.008] REF.
0.80[0.031] MAX.
PIN1 ID
0°-12°
4.45[0.175]
6.10[0.240]
5.80[0.228]
4.55[0.179]
0.45[0.018]
0.20[0.008] R.
DIA.
0.28[0.011]
0.30[0.012]
0.60[0.024]
TOP VIEW
BOTTOM VIEW
SIDE VIEW
E-PAD
(PAD SIZE VARY
BY DEVICE TYPE)
40-lead QFN 6 x 6 MM LF40A
51-85190-**
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