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HDD32M72B9-13B Datasheet(PDF) 4 Page - Hanbit Electronics Co.,Ltd

Part # HDD32M72B9-13B
Description  DDR SDRAM Module 256Mbyte (32Mx72bit), based on32Mx8,4Banks, 8K Ref., ECC Unbuffered SO-DIMM
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Manufacturer  HANBIT [Hanbit Electronics Co.,Ltd]
Direct Link  http://www.hbe.co.kr
Logo HANBIT - Hanbit Electronics Co.,Ltd

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HANBit
HDD32M72B9
URL : www.hbe.co.kr
4
HANBit Electronics Co.,Ltd.
REV 1.0 (July. 2003)
PIN FUNCTION DESCRIPTION
Pin
Name
Input Function
CK, /CK
Clock
CK and CK are differential clock inputs. All address and control input signals are
sam-pled on the positive edge of CK and negative edge of CK. Output (read) data
is referenced to both edges of CK. Internal clock signals are derived from CK/CK.
CKE
Clock Enable
CKE HIGH activates, and CKE LOW deactivates internal clock signals, and device
input buffers and output drivers. Deactivating the clock provides PRECHARGE
POWER-DOWN and SELF REFRESH operation (all banks idle), or ACTIVE
POWER-DOWN(row ACTIVE in any bank). CKE is synchronous for all functions
except for disabling outputs, which is achieved asynchronously. Input buffers,
excluding CK, CK and CKE are disabled during power-down and self refresh modes,
providing low standby power. CKE will recognizean LVCMOS LOW level prior to
VREF being stable on power-up.
/CS
Chip Select
CS enables(registered LOW) and disables(registered HIGH) the command decoder.
All commands are masked when CS is registered HIGH. CS provides for external
bank selection on systems with multiple banks. CS is considered part of the
command code.
A0 ~ A12
Address
Row/column addresses are multiplexed on the same pins.
Row address : RA0 ~ RA12, Column address : CA0 ~ CA9
BA0 ~ BA1
Bank select address
BA0 and BA1 define to which bank an ACTIVE, READ, WRITE or PRE-CHARGE
command is being applied.
/RAS
Row address strobe
Latches row addresses on the positive going edge of the CLK with /RAS low.
Enables row access & precharge.
/CAS
Column
address
strobe
Latches column addresses on the positive going edge of the CLK with /CAS low.
Enables column access.
/WE
Write enable
Enables write operation and row precharge.
Latches data in starting from /CAS, /WE active.
DQS0 ~ 8
Data Strobe
Output with read data, input with write data. Edge -aligned with read data, cen-
tered in write data. Used to capture write data.
DM0~8
Input Data Mask
DM is an input mask signal for write data. Input data is masked when DM is
sampled HIGH along with that input data during a WRITE access. DM is sampled
on both edges of DQS. DM pins include dummy loading internally, to matches the
DQ and DQS load-ing.
DQ0 ~ 63
Data input/output
Data inputs/outputs are multiplexed on the same pins.
CB0 ~ 7
Check Bit
Check Bits for ECC data are multiplexed on the same pins.
VDDQ
Supply
DQ Power Supply : +2.5V
± 0.2V.
VDD
Supply
Power Supply : +2.5V
± 0.2V (device specific).
VSS
Supply
DQ Ground.
VREF
Supply
SSTL_2 reference voltage.
VDDSPD
Supply
Serial EEPROM Power Supply : 3.3v
VDDID
VDD identification Flag


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