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Specifications (characteristics)
Recommended soldering pattern
External dimensions
(Unit: mm)
Do not connect #2 and #3 to external device.
Internal connection
(Unit: mm)
#4
#4
#3
#1
#2
#3
#1
0.5
5.5
(0.9)
(0.9)
1.9
#2
8.0 max.
20.000M
572
E
1.3
1.3
4.2
SMALL SMD HIGH - FREQUENCY CRYSTAL UNIT
MA-306
• High-density mounting-type SMD.
• Excellent reliability and environment capability.
• Capable of covering a wide frequency range. ( from 17.734 MHz
to 41 MHz)
• 2.54mm thickness is equal to SMD-type IC.
Item
Nominal frequency
Temperature
range
Drive level
Soldering condition
Frequency tolerance (standard)
Frequency temperature characteristics
(standard)
Load capacitance
Series resistance
Shunt capacitance
Insulation resistance
Aging
Shock resistance
Symbol
f
TSTG
TOPR
GL
DL
TSOL
∆f/f
CL
R1
C0
IR
fa
S.R.
Specifications
17.734 MHz to 41.000 MHz
-55˚C to +100˚C
-20˚C to +70˚C
2mW max.
10µW to 100µW
Twice at under 260˚C within 10 sec.
or under 230˚C within 3 min.
±50ppm
±30ppm
10pF to
∞
60
Ω max.
5pF max.
500 M
Ω min.
±5ppm/Y max.
±10ppm max.
Remarks
Fundamental mode
Stored as bare product after unpacking
Only crystal oscillation is guaranteed
Ta=25˚C±3˚C
-20˚C to +70˚C
Please specify
-20˚C to +70˚C, DL=100µW
Ta=25˚C±3˚C, first year
Three drops on a hard board from 75 cm or excitation
test with 3000G x 0.3ms x 1/2 sine wave x 3 directions
Storage temperature
Operating temperature
Maximum drive level
Recommended drive level
Actual size
There are some cases that a parts of the cylindrical capsule of quartz unit expose on the surface of the molding material.
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