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K4X51163PC-FGC3 Datasheet(PDF) 11 Page - Samsung semiconductor

Part # K4X51163PC-FGC3
Description  32M x16 Mobile-DDR SDRAM
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

K4X51163PC-FGC3 Datasheet(HTML) 11 Page - Samsung semiconductor

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K4X51163PC - L(F)E/G
February 2006
Mobile-DDR SDRAM
DC CHARACTERISTICS
Recommended operating conditions (Voltage referenced to VSS = 0V, Tc = -25 to 85
°C)
Parameter
Symbol
Test Condition
DDR266
DDR222
Unit
Operating Current
(One Bank Active)
IDD0
tRC = tRCmin ; tCK = tCKmin ; CKE is HIGH; CS is HIGH between valid commands;
address inputs are SWITCHING; data bus inputs are STABLE
80
70
mA
Precharge Standby Current in
power-down mode
IDD2P
all banks idle, CKE is LOW; CS is HIGH, tCK = t CKmin ; address and control inputs are
SWITCHING; data bus inputs are STABLE
0.3
mA
IDD2PS
all banks idle, CKE is LOW; CS is HIGH, CK = LOW, CK = HIGH; address and control
inputs are SWITCHING; data bus inputs are STABLE
0.3
Precharge Standby Current
in non power-down mode
IDD2N
all banks idle, CKE is HIGH; CS is HIGH, tCK = t CKmin ;address and control inputs are
SWITCHING; data bus inputs are STABLE
12
10
mA
IDD2NS
all banks idle, CKE is HIGH; CS is HIGH, CK = LOW, CK = HIGH; address and control
inputs are SWITCHING; data bus inputs are STABLE
8
7
Active Standby Current
in power-down mode
IDD3P
one bank active, CKE is LOW; CS is HIGH, tCK = tCKmin ;address and control inputs are
SWITCHING; data bus inputs are STABLE
6
mA
IDD3PS
one bank active, CKE is LOW; CS is HIGH, CK = LOW, CK = HIGH;address and control
inputs are SWITCHING; data bus inputs are STABLE
3
Active Standby Current
in non power-down mode
(One Bank Active)
IDD3N
one bank active, CKE is HIGH; CS is HIGH, tCK = tCKmin ;address and control inputs
are SWITCHING; data bus inputs are STABLE
25
20
mA
IDD3NS
one bank active, CKE is HIGH; CS is HIGH, CK = LOW, CK = HIGH;
address and control inputs are SWITCHING; data bus inputs are STABLE
20
15
Operating Current
(Burst Mode)
IDD4R
one bank active; BL = 4; CL = 3; tCK = tCKmin ; continuous read bursts; I OUT = 0 mA
address inputs are SWITCHING; 50% data change each burst transfer
115
95
mA
IDD4W
one bank active; BL = 4; tCK = tCKmin ; continuous write bursts;address inputs are
SWITCHING; 50% data change each burst transfer
100
90
Refresh Current
IDD5
tRC = tRFCmin ; tCK = tCKmin ; burst refresh; CKE is HIGH;address and control inputs
are SWITCHING; data bus inputs are STABLE
150
135
mA
Self Refresh Current
IDD6
CKE is LOW; tCK = tCKmin ;
Extended Mode Register set to all 0’s;
address and control inputs are STABLE; data bus inputs
are STABLE
TCSR
45*1
85
°C
-E
Full Array
300
600
uA
1/2 Array
270
500
1/4 Array
255
450
-G
Full Array
250
500
1/2 Array
220
400
1/4 Array
205
350
Deep Power Down Current
IDD8*2
Address and control inputs are STABLE; data bus inputs are STABLE
10
uA
Note :
1. It has +/- 5°C tolerance.
2. DPD(Deep Power Down) function is an optional feature, and it will be enabled upon request.
Please contact Samsung for more information.
3. IDD specifications are tested after the device is properly intialized.
4. Input slew rate is 1V/ns.
5. Definitions for IDD: LOW is defined as V IN
0.1 * VDDQ ;
HIGH is defined as V IN
0.9 * VDDQ ;
STABLE is defined as inputs stable at a HIGH or LOW level ;
SWITCHING is defined as: - address and command: inputs changing between HIGH and LOW once per two clock cycles ;
- data bus inputs: DQ changing between HIGH and LOW once per clock cycle; DM and DQS are STABLE.


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