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MB82DBS08164C-70L Datasheet(PDF) 1 Page - Fujitsu Component Limited.

Part # MB82DBS08164C-70L
Description  128 M Bit (8 M word횞16 bit) Mobile Phone Application Specific Memory
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Manufacturer  FUJITSU [Fujitsu Component Limited.]
Direct Link  http://edevice.fujitsu.com/fmd/en/index.html
Logo FUJITSU - Fujitsu Component Limited.

MB82DBS08164C-70L Datasheet(HTML) 1 Page - Fujitsu Component Limited.

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DS05-11435-1E
FUJITSU SEMICONDUCTOR
DATA SHEET
Copyright©2006 FUJITSU LIMITED All rights reserved
MEMORY Mobile FCRAMTM
CMOS
128 M Bit (8 M word
×16 bit)
Mobile Phone Application Specific Memory
MB82DBS08164C-70L
■ DESCRIPTION
The FUJITSU MB82DBS08164C is a CMOS Fast Cycle Random Access Memory (FCRAM*) with asynchronous
Static Random Access Memory (SRAM) interface containing 134,217,728 storages accessible in a 16-bit format.
MB82DBS08164C is utilized using a FUJITSU advanced FCRAM core technology and improved integration in
comparison to regular SRAM.
The MB82DBS08164C adopts asynchronous mode and synchronous burst mode for fast memory access as user
configurable options.
This MB82DBS08164C is suited for mobile applications such as Cellular Handset and PDA.
* : FCRAM is a trademark of Fujitsu Limited, Japan
■ FEATURES
• Asynchronous SRAM Interface
• COSMORAM Revision 3 Compliance
(COSMORAM : Common Specifications of Mobile RAM)
• Fast Access Time : tCE = 70 ns Max
• Burst Read/Write Access Capability :
tCK
= 9.5 ns Min /104 MHz Max
tAC
= 6 ns Max
• Low Voltage Operating Condition : VDD = 1.7 V to 1.95 V
• Wide Operating Temperature : TA =
− 30 °C to + 85 °C
Junction Temperature : TJ
= − 30 °C to + 90 °C
• Byte Control by LB and UB
• Low-Power Consumption : IDDA1 = 40 mA Max
IDDS1 = 300
µA Max
• Various Power Down mode : Sleep
16 M-bit Partial
32 M-bit Partial
64 M-bit Partial
• Shipping Form : Wafer/Chip


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