5

FTR-F3 sERIEs

. General Information

l

Relays produced after the specific date code that is indicated on each data sheet are lead-free

now.Mostofoursignalandpowerrelaysarelead-free.PleaserefertoLead-FreeStatusInfo.

(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)

l

LeadfreesolderpastecurrentlyusedinrelaysisSn-3.0Ag-0.5Cu.

l

AllsignalandmostpowerrelaysalsocomplywithRoHS.Pleaserefertoindividualdata

sheets.RelaysthatareRoHScompliantdonotcontainthe5hazardousmaterialsthat

arerestrictedbyRoHSdirective(lead,mercury,chromiumIV,PBB,PBDE).

l

It has been verified that using lead-free relays in leaded assembly process will not cause any

problems(compatible).

l

“LF”ismarkedoneachouterandinnercarton.(Nomarkingonindividualrelays).

l

To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.

l

Wewillshipleadedrelaysaslongastheleadedrelayinventoryexists.

Note:CadmiumwasexemptedfromRoHSonOctober21,2005.(AmendmenttoDirective2002/95/EC)

2. Recommended Lead Free Solder Profile

l

RecommendedsolderpasteSn-3.0Ag-0.5Cu.

RoHs compliance and Lead Free Relay Information

Reflow Solder condtion

3. Moisture sensitivity

l

MoistureSensitivityLevelstandardisnotapplicabletoelectromechanicalrealys.

4. Tin Whisker

l

DippedSnAgCusolderisknownaslowrisktinwhisker.Noconsiderablelengthwhiskerwasfoundbyourin

housetest.

We highly recommend that you confirm your actual solder conditions

Flow Solder condtion:

Pre-heating:

maximum 120˚C

Soldering:

dipwithin5sec.at

260˚C soler bath

Solder by Soldering Iron:

SolderingIron

Temperature: maximum 360˚C

Duration:

maximum3sec.