Rev 1.0 – July 2005

www.enpirion.com

EN5330

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Landing Pad Information

The Enpirion DFN package is footprint compatible with the JEDEC standard 36-pin TSSOP package code DD.

The reference document and board layout diagram appear below.

JEDEC Solid State Technology Association TSSOP (Plastic Thin Shrink Small Outline Package)

standardized package code DD. This TSSOP standard package is defined in the JEDEC document

MO-153, Issue F, dated 05/01, which defines 57 variations on package size, lead pitch, and lead

count.

Contact Information

Enpirion, Inc.

685 Route 202/206

Suite 305

Bridgewater, NJ 08807

Phone: 908-575-7550

Fax: 908-575-0775

Enpirion reserves the right to make changes in circuit design and/or specifications at any time without notice. Information furnished by Enpirion is believed to be

accurate and reliable. Enpirion assumes no responsibility for its use or for infringement of patents or other third party rights, which may result from its use. Enpirion

products are not authorized for use in nuclear control systems, as critical components in life support systems or equipment used in hazardous environment without the

express written authority from Enpirion.