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B7502PFA Datasheet(PDF) 1 Page - DIOTEC Electronics Corporation |
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B7502PFA Datasheet(HTML) 1 Page - DIOTEC Electronics Corporation |
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1 / 1 page  FEATURES MECHANICAL SPECIFICATION MECHANICAL DATA MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS Data Sheet No. B75PF-1A 75 AMP PRESS FIT HIGH VOLTAGE DIODES DIOTEC ELECTRONICS CORP VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 5% of Die Area) HUGE ROUND DIE FOR ULTRA HIGH POWER & HEAVY DUTY PERFORMANCE PRESS FIT INTO HEAT SINK TO FURTHER ENHANCE HEAT HANDLING CAPABILITY PROPRIETARY HIGH TEMPERATURE JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE LOW THERMAL STRESS STRUCTURE - PASS 5 CYCLE (-55 C TO +150 C) THERMAL SHOCK TEST ROUND DIE 0.250” 78 Places Equally Spaced 0.007” 0.005” 70 Typ. ALL DIMENSIONS IN INCHES B7504A DT 0452 0.052 0.002” ”+ _ 0.505 /502 ” ” OVER KNURL 1.02” 0.98” 0.401” 0.385” 0.173” 0.157” 0.039” 0.031” 0.194” 0.184” RoHS CO MPLIANT |
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