RHOPOINT COMPONENTS LTD.
Holland Road
Hurst Green
Oxted, Surrey, RH8 9AX
Tel: +44 (0)1883 717988
Fax: +44 (0)1883 712938
Email: components@rhopoint.co.uk
Website: www.rhopoint.co.uk/components/
© 1999 Caddock Electronics, Inc.
CAD
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DOC
IL-103.039
TO-126 and TO-220 Style Power Packages - Non-Inductive Designs
MP808 / MP825 (TO-126 style) and MP816 / MP850 (TO-220 style)
Kool-Pak
® Power Film Resistors
Use your thermal design experience with power semiconductors in the TO-220 and TO-126 style power package. This
experience will help you get the most out of this unique family of power resistors. The thermal design issues are the
same where power handling capability is based on the case temperature which is maintained in your design.
Page 1 of 2
Construction of MP808 and MP816:
MP 816 Kool-Pak® Power Resistors
TO-220 Style Power Package
MP808 and MP816 with an All Molded Package Configuration
MP 808 Kool-Pak® Power Resistors
TO -126 Style Power Package
8 Watts at +25
°C CaseTemperature
derated to zero at +150
°C
Thermally Conductive Molded Package
Lower Cost
Resistance Range of 0.020 ohm to 10.0K
Resistor element is electrically isolated from
the mounting surface
•
•
•
•
•
16 Watts at +25
°C CaseTemperature
derated to zero at +150
°C
Thermally Conductive Molded Package
Lower Cost
Resistance Range of 0.10 ohm to 10.0K
Resistor element is electrically isolated from
the mounting surface
The MP808 and MP816 Kool-Pak® Power Film Resistors are constructed with Caddock's
Micronox® resistance film fired onto a flat ceramic substrate. The terminal attachment and resistance element geometry are configured to provide
outstanding non-inductive performance. The resistor body is completely surrounded by a high thermal conductivity molding compound to finish this
cost effective power resistor package.
8 Watts
16 W
atts
•
•
•
•
•
MP 825 Kool-Pak® Power Resistors
TO-126 Style Power Package
The MP825 and MP850 Kool-Pak® Power Film Resistors are constructed with Caddock's
Micronox® resistance film fired onto a flat ceramic substrate. The terminal attachment and resistance element geometry are configured to provide
outstanding non-inductive performance. The ceramic substrate is bonded to a copper heat sink which becomes the metal mounting surface.
This assembly is molded in a high thermal conductivity molding compound with the copper heat sink flush with the back surface of the part.
MP825 and MP850 Power Packages Include an Integral
Metal Mounting Surface for Highly Efficient Thermal Transfer
MP 850 Kool-Pak® Power Resistors
TO-220 Style Power Package
Construction of MP825 and MP850:
•
•
•
•
25 Watts at +25
°C CaseTemperature
derated to zero at +150
°C
Copper Heat Sink Integral in the Molded Package
Resistance Range of 0.020 ohm to 10.0K
Resistor element is electrically isolated from
the mounting surface
25 W
atts
50 W
atts
•
•
•
•
50 Watts at +25
°C CaseTemperature
derated to zero at +150
°C
Copper Heat Sink Integral in the Molded Package
Resistance Range of 0.20 ohm to 10.0K
Resistor element is electrically isolated from
the mounting surface
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