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M36L0R8060B1ZAQF Datasheet(PDF) 7 Page - STMicroelectronics

Part # M36L0R8060B1ZAQF
Description  256 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory and 64 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M36L0R8060B1ZAQF Datasheet(HTML) 7 Page - STMicroelectronics

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M36L0R8060T1, M36L0R8060B1
SIGNAL DESCRIPTIONS
See Figure 2., Logic Diagram and Table 1., Signal
Names, for a brief overview of the signals connect-
ed to this device.
Address Inputs (A0-A23). Addresses
A0-A21
are common inputs for the Flash memory and
PSRAM components. The other lines (A23-A22)
are inputs for the Flash memory component only.
The Address Inputs select the cells in the memory
array to access during Bus Read operations. Dur-
ing Bus Write operations they control the com-
mands sent to the Command Interface of the
internal state machine. The Flash memory is ac-
cessed through the Chip Enable signal (EF) and
through the Write Enable signal (WF), while the
PSRAM is accessed through the Chip Enable sig-
nal (EP) and the Write Enable signal (WP).
Data Input/Output (DQ0-DQ15). The Data I/O
output the data stored at the selected address dur-
ing a Bus Read operation or input a command or
the data to be programmed during a Bus Write op-
eration.
For the PSRAM component, the upper Byte Data
Inputs/Outputs (DQ8-DQ15) carry the data to or
from the upper part of the selected address when
Upper Byte Enable (UBP) is driven Low. The lower
Byte Data Inputs/Outputs (DQ0-DQ7) carry the
data to or from the lower part of the selected ad-
dress when Lower Byte Enable (LBP) is driven
Low. When both UBP and LBP are disabled, the
Data Inputs/ Outputs are high impedance.
Latch Enable (L). The Latch Enable pin is com-
mon to the Flash memory and PSRAM compo-
nents.
For details of how the Latch Enable signal be-
haves, please refer to the datasheets of the re-
spective memory components: M69KB096AA for
the PSRAM and M30L0R8000T/B0 for the Flash
memory.
Clock (K). The Clock input pin is common to the
Flash memory and PSRAM components.
For details of how the Clock signal behaves,
please refer to the datasheets of the respective
memory
components:
M69KB096AA
for
the
PSRAM and M30L0R8000T/B0 for the Flash
memory.
Wait (WAIT). WAIT is an output pin common to
the Flash memory and PSRAM components. How-
ever the WAIT signal does not behave in the same
way for the PSRAM and the Flash memory.
For details of how it behaves, please refer to the
M69KB096AA datasheet for the PSRAM and to
the M30L0R8000T/B0 datasheet for the Flash
memory.
Flash Chip Enable (EF). The Flash Chip Enable
input activates the control logic, input buffers, de-
coders and sense amplifiers of the Flash memory
component. When Chip Enable is Low, VIL, and
Reset is High, VIH, the device is in active mode.
When Chip Enable is at VIH the Flash memory is
deselected, the outputs are high impedance and
the power consumption is reduced to the standby
level.
Flash Output Enable (GF). The Output Enable
pin controls the data outputs during Flash memory
Bus Read operations.
Flash Write Enable (WF). The
Write
Enable
controls the Bus Write operation of the Flash
memory’s Command Interface. The data and ad-
dress inputs are latched on the rising edge of Chip
Enable or Write Enable whichever occurs first.
Flash Write Protect (WPF). Write Protect is an
input that gives an additional hardware protection
for each block. When Write Protect is Low, VIL,
Lock-Down is enabled and the protection status of
the Locked-Down blocks cannot be changed.
When Write Protect is at High, VIH, Lock-Down is
disabled and the Locked-Down blocks can be
locked or unlocked. (See the Lock Status Table in
the M30L0R8000T0/B0 datasheet).
Flash Reset (RPF). The Reset input provides a
hardware reset of the Flash memory. When Reset
is at VIL, the memory is in Reset mode: the outputs
are high impedance and the current consumption
is reduced to the Reset Supply Current IDD2. Refer
to Table 6., Flash Memory DC Characteristics -
Currents, for the value of IDD2. After Reset all
blocks are in the Locked state and the Configura-
tion Register is reset. When Reset is at VIH, the
device is in normal operation. Exiting Reset mode
the device enters Asynchronous Read mode, but
a negative transition of Chip Enable or Latch En-
able is required to ensure valid data outputs.
The Reset pin can be interfaced with 3V logic with-
out any additional circuitry. It can be tied to VRPH
(refer to Table 7., Flash Memory DC Characteris-
tics - Voltages).
PSRAM Chip Enable input (EP). The Chip En-
able input activates the PSRAM when driven Low
(asserted). When deasserted (VIH), the device is
disabled, and goes automatically in low-power
Standby mode or Deep Power-down mode.
PSRAM Write Enable (WP). Write Enable, WP,
controls the Bus Write operation of the PSRAM.
When asserted (VIL), the device is in Write mode
and Write operations can be performed either to
the configuration registers or to the memory array.
PSRAM Output Enable (GP). Output
Enable,
GP, provides a high speed tri-state control, allow-
ing fast read/write cycles to be achieved with the
common I/O data bus.


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