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P0120004P Datasheet(PDF) 10 Page - Eudyna Devices Inc |
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P0120004P Datasheet(HTML) 10 Page - Eudyna Devices Inc |
10 / 13 page Specifications and information are subject to change without notice. 2003-11 Sumitomo Electric Industries, Ltd. 1,Taya-cho, Sakae-ku, Yokohama, 244-8588 Japan Phone: +81-45-853-7263 Fax: +81-45-853-1291 e-mail : GaAsIC-ml@ml.sei.co.jp Web Site: www.sei.co.jp/GaAsIC/ -10- Technical Note P0120004P 1.5W GaAs Power FET (Pb-Free Type) SUMITOMO ELECTRIC [Using Heat Sink] The junction temperature can be calculated by the following formula. If you cannot get the junction temperature lower than the absolute maximum rating only with the plated thru holes, then you need to employ the heat sink. Attaching the heat sink directly under pin 4 of the device improves the thermal resistance between junction and ambient. Tjmax=(Vds*Ids-Pout)(Rth+Rboard+Rhs)+Ta Pout: Output power Rth: Thermal resistance between channel and case Rboard: Thermal resistance of PCB Rhs: Thermal resistance of heat sink Ta:Ambient temperature Tjmax: Maximum junction temperature Generally, there are two ways of heat radiation. One is the plated thru hole and the other is the heat sink. Key points will be illustrated in each case below. Note that no measure against oscillation is adopted in the figures. In the design of circuit and layout, you should take stabilizing into account if necessary. [Using Thru Hole] G □Multiple plated thru holes are required directly below the device. φ0.4 Plated Thru Holes φ3 Plated Thru Hole for 2.5 M achine Screws Package Outline 4-R0.3 Heatsink 2 1.9 ×2.85 (4-R0.3) φ5 Soldermask Keepout φ3 Plated Thru Hole for 2.5 M achine Screws φ5 Soldermask Keepout Grand Plane rand Plane □Place more than 2 machine screws as close to the ground pin (pin 4) as possible. The PCB is screwed on the mounting plate or the heat sink to lower the thermal resistance of the PCB. [Note] □Ground/thermal vias are critical for the proper device performance. Drills of the recommended diameters should be used in the fabrication of vias. □Lay out a large ground pad area with multiple plated thru holes around pin 4 of the device. □Add as much copper a s possible to inner and outer layers near the part to ensure optimal thermal performance. □The required matching and feedback circuit described in the application circuit examples should be connected to the device, although it is not shown in the figure below. □Mounting screws can be added near the part to fasten the board to heat sink. Ensure that the ground/thermal via region contacts the heat sink. □Do not put solder mask on the backside of the PCB in the region where the board contacts the heat sink. φ0.4 Plated Thru Holes φ0.3 Plated Thru Holes φ3 Plated Thru Hole for 2.5 Machine Screws φ5 Soldermask Keepout Package Outline Keepout φ3 Plated Thru Hole for 2.5 Machine Screws Grand Plane φ5 Soldermask φ0.4 Plated Thru Holes φ0.3 Plated Thru Holes φ3 Plated Thru Hole for 2.5 Machine Screws φ5 Soldermask Keepout Package Outline Keepout φ3 Plated Thru Hole for 2.5 Machine Screws Grand Plane φ5 Soldermask □RF trace width depends upon the PCB material and construction. □Use 1 oz. Copper minimum. |
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