Released Process

TQTRx

GaAs MESFET Foundry Service

Semiconductors for Communications

www.triquint.com

TriQuint Semiconductor

2300 NE Brookwood Pkwy

Hillsboro, Oregon 97124

Phone: 503-615-9000

Fax: 503-615-8905

Email: info@triquint.com

Page 1 of 7; Rev 1.0 11/15/01

TQTRx Process Cross-Section

Production Process

TQRLC

Advanced Passives Foundry Service

Features

•

Thick 4 Layer Metal; > 9 µm total

thickness

•

High Density Interconnects:

•

3 Global

•

1 Local

•

High-Q Passives; Inductor Q >50

@ 2 GHz

•

Low Cost: Passives Only

•

Thin Film Resistors

•

Dielectric Encapsulated Metals

•

Planarized Surface;

simplified plastic packaging

•

Volume Production Process

Applications

•

Passive Components:

•

Phase Shifters

•

Baluns

•

Transformers

•

Couplers

•

Mixers (with off-chip di-

ode arrays)

•

Circuits Requiring High-Q

Passive Elements

•

Matching Circuits

•

RF Module Front-End Filters

•

General RF and Microwave Imped-

ance Matching

General Description

TriQuint’s TQRLC is a pure passives process. It is targeted at

high performance, small size passive-only circuits and utilizes

over 9 µm of gold metal. High density interconnections are ac-

complished with three thick global and one surface metal inter-

connect layers. The four metal layers are encapsulated in a high

performance, low dielectric constant material that allows wiring

flexibility and plastic packaging simplicity. Precision NiCr resis-

tors, inductors, and high value MIM capacitors are available.

The process is based on the TQTRx process, currently

TriQuint’s highest volume process.

The TQRLC process is

available on 150-mm (6 inch) wafers.

Semiconductors for Communications

www.triquint.com

TriQuint Semiconductor

2300 NE Brookwood Pkwy

Hillsboro, Oregon 97124

Phone: 503-615-9000

Fax: 503-615-8905

Email: info@triquint.com

Page 1 of 3; Rev 2.3 3/18/04

TQRLC Process Cross-Section