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5 page 
CYStech Electronics Corp. Spec. No. : C308N3 Issued Date : 2002.06.11 Revised Date : 2005.06.01 Page No. : 5/5 BTA1721N3 CYStek Product Specification SOT-23 Dimension *: Typical Inches Millimeters Inches Millimeters DIM Min. Max. Min. Max. DIM Min. Max. Min. Max. A 0.1102 0.1204 2.80 3.04 J 0.0034 0.0070 0.085 0.177 B 0.0472 0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67 C 0.0335 0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15 D 0.0118 0.0197 0.30 0.50 S 0.0830 0.1083 2.10 2.75 G 0.0669 0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65 H 0.0005 0.0040 0.013 0.10 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. H J K D A L G V C B 3 2 1 S Style: Pin 1.Base 2.Emitter 3.Collector Marking: TE 3-Lead SOT-23 Plastic Surface Mounted Package CYStek Package Code: N3 2D |
