NTHC5513

http://onsemi.com

8

Figure 22. Basic

Figure 23. Style 2

0.457

0.018

2.032

0.08

0.635

0.025

0.66

0.026

0.711

0.028

0.457

0.018

2.032

0.08

0.635

0.025

0.66

0.026

0.254

0.010

1.092

0.043

0.178

0.007

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

BASIC PAD PATTERNS

The basic pad layout with dimensions is shown in

Figure 22. This is sufficient for low power dissipation

MOSFET

applications,

but

power

semiconductor

performance requires a greater copper pad area, particularly

for the drain leads.

The minimum recommended pad pattern shown in

Figure 23 improves the thermal area of the drain

connections (pins 5, 6, 7, 8) while remaining within the

confines of the basic footprint. The drain copper area is

0.0019 sq. in. (or 1.22 sq. mm). This will assist the power

dissipation path away from the device (through the copper

lead−frame) and into the board and exterior chassis (if

applicable) for the single device. The addition of a further

copper area and/or the addition of vias to other board layers

will enhance the performance still further.