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AD8384 Datasheet(PDF) 8 Page - Analog Devices |
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AD8384 Datasheet(HTML) 8 Page - Analog Devices |
8 / 24 page AD8384 Rev. 0 | Page 8 of 24 ABSOLUTE MAXIMUM RATINGS Table 6. AD8384 Stress Ratings9 Parameter Rating Supply Voltages AVCCx – AGNDx 18 V DVCC – DGND 4.5 V Input Voltages Maximum Digital Input Voltage DVCC + 0.5 V Minimum Digital Input Voltage DGND – 0.5 V Maximum Analog Input Voltage AVCC + 0.5 V Minimum Analog Input Voltages AGND – 0.5 V Internal Power Dissipation10 TQFP E-Pad Package @ TA = 25°C 4.16 W Operating Temperature Range 0°C to 85°C Storage Temperature Range –65°C to +125°C Lead Temperature Range (Soldering 10 sec) 300°C 9 Stresses above those listed under the Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to the absolute maximum ratings for extended periods may reduce device reliability. 10 80-lead TQFP E-pad package: θJA = 24°C/W (JEDEC STD, 4-layer PCB in still air) θJC = 16°C/W MAXIMUM POWER DISSIPATION The maximum power that can be safely dissipated by the AD8384 is limited by its junction temperature. The maximum safe junction temperature for plastic encapsulated devices, as determined by the glass transition temperature of the plastic, is approximately 150°C. Exceeding this limit temporarily may cause a shift in the parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of 175°C for an extended period can result in device failure. OPERATING TEMPERATURE RANGE Although the maximum safe operating junction temperature is higher, the AD8384 is 100% tested at a junction temperature of 125°C. Consequently, the maximum guaranteed operating junction temperature is 125°C. To ensure operation within the specified temperature range, it is necessary to limit the maximum power dissipation as follows: ) ( 5 . 0 – ) – ( lfm Airflow T T P JA A JMAX DMAX × θ ≈ OVERLOAD PROTECTION The AD8384 employs a 2-stage overload protection circuit that consists of an output current limiter and a thermal shutdown. The maximum current at any one output of the AD8384 is, on average, internally limited to 100 mA. In the event of a momen- tary short circuit between a video output and a power supply rail (VCC or AGND), the output current limit is sufficiently low to provide temporary protection. The thermal shutdown debiases the output amplifier when the junction temperature reaches the internally set trip point. In the event of an extended short-circuit between a video output and a power supply rail, the output amplifier current continues to switch between 0 mA and 100 mA typical with a period deter- mined by the thermal time constant and the hysteresis of the thermal trip point. Thermal shutdown provides long term pro- tection by limiting average junction temperature to a safe level. EXPOSED PADDLE To ensure optimized thermal performance, the exposed paddle must be thermally connected to an external plane, such as AVCC or GND, as described in the Application Notes. 1.0 2.0 1.5 2.5 85 80 70 75 65 90 95 100 105 AMBIENT TEMPERATURE (°C) 100MHz 60Hz XGA QUIESCENT STILL AIR 200lfm 500lfm Figure 2. Maximum Power Dissipation vs. Temperature* *AD8384 on a 4-layer JEDEC PCB with thermally optimized landing pattern, as described in the Application Notes. Note: When operating under the conditions specified in this data sheet, the AD8384’s quiescent power dissipation is 1.1 W. When driving a 6-channel XGA panel with a 150 pF input capacitance, the AD8384 dissipates a total of 1.58 W when displaying 1-pixel-wide alternating white and black vertical lines generated by a standard 60 Hz XGA input video. When the pixel clock frequency is raised to 100 MHz (the AD8384’s maximum specified operating frequency), total power dissipation increases to 1.83 W. Figure 2 shows these specific power dissipations. |
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