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PA75 Datasheet(PDF) 4 Page - Cirrus Logic

Part No. PA75
Description  DUAL POWER OPERATIONAL AMPLIFIERS
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Maker  APEX [Cirrus Logic]
Homepage  http://www.cirrus.com
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APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739
4
OPERATING
CONSIDERATIONS
PA75
This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All specifications are subject to change without notice.
PA75U REV D MARCH 2006 © 2006 Apex Microtechnology Corp.
GENERAL
Please read Application Note 1 “General Operating Consider-
ations” which covers stability, supplies, heatsinking, mounting,
SOA interpretation, and specification interpretation. Visit www.
apexmicrotech.com for design tools that help automate tasks
such as calculations for stability, internal power dissipation,
heatsink selection; Apex’s complete Application Notes library;
Technical Seminar Workbook; and Evaluation Kits.
STABILITY CONSIDERATIONS
All monolithic power op amps use output stage topologies
that present special stability problems. This is primarily due to
non-complementary (both devices are NPN) output stages with
a mismatch in gain and phase response for different polarities
of output current. It is difficult for the op amp manufacturer to
optimize compensation for all operating conditions.
SAFE OPERATING AREA (SOA)
The SOA curves combine the effect of all limits for this power
op amp. For a given application, the direction and magnitude
of the output current should be calculated or measured and
checked against the SOA curves. This is simple for resistive
loads but more complex for reactive and EMF generating
loads.
THERMAL CONSIDERATIONS
The PA75CD and CX have a large exposed copper heat
tab to which the monolithic is directly attached. The PA75CD
and CX may require a thermal washer, which is electrically
insulating since the tab is directly tied to -VS. This can result
in a thermal impedance RCS of up to 1˚C/W or greater.
The PA75CC has a large exposed integrated copper heatslug
to which the monolithic is directly attached. The solder connec-
tion of the heatslug to a minimum of 1 square inch foil area of
the printed circuit board will result in thermal performance of
25°C/W junction to air rating of the PA75CC. Solder connec-
tion to an area of 1 to 2 square inches of foil is required for
minimal power applications
Where the PA75CC is used in higher power applications,
it is necessary to use surface mount techniques of heatsink-
ing. Surface mount techniques include the use of a surface
mount fan in combination with a surface mount heatsink on
the backside of the FR4/ PC board with through hole thermal
vias. Other highly thermal conductive substrate board materials
are available for maximum heat sinking.
MOUNTING PRECAUTIONS
1. Always use a heat sink. Even unloaded the PA75 can dis-
sipate up to .4 watts.
2. Avoid bending the leads. Such action can lead to internal
damage.
3. Always fasten the tab of the CD and CX package to the heat
sink before the leads are soldered to fixed terminals.
4. Strain relief must be provided if there is any probability of
axial stress to the leads.




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