MSK5920-3.3ERHD datasheet(4/7 Pages) MSK

Part #	MSK5920-3.3ERHD

Description	RAD TOLERANT ULTRA LOW DROPOUT POSITIVE LINEAR REGULATOR

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Manufacturer	MSK [M.S. Kennedy Corporation]

Direct Link	http://www.mskennedy.com

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4 / 7 page

APPLICATION NOTES CONT.

4

HEAT SINK SELECTION

To select a heat sink for the MSK 5920RH, the follow-

ing formula for convective heat flow may be used.

Governing Equation:

TJ = PD X (R

θJC + RθCS + RθSA) + TA

Where

TJ

= Junction Temperature

PD

= Total Power Dissipation

R

θJC

= Junction to Case Thermal Resistance

R

θCS = Case to Heat Sink Thermal Resistance

R

θSA = Heat Sink to Ambient Thermal Resistance

TA

= Ambient Temperature

Power Dissipation=(VIN-VOUT) x IOUT

Next, the user must select a maximum junction tem-

perature. The absolute maximum allowable junction tem-

perature is 150°C. The equation may now be rearranged

to solve for the required heat sink to ambient thermal

resistance (R

θSA).

Example:

An MSK 5920-2.5RH is connected for VIN=+3.3V and

VOUT=+2.5V. IOUT is a continuous 3A DC level. The am-

bient temperature is +25°C. The maximum desired junc-

tion temperature is +125°C.

R

θJC=4.0°C/W and RθCS=0.15°C/W for most thermal

greases

Power Dissipation=(3.3V-2.5V) x (3A)

=2.4 Watts

Solve for R

θSA:

125°C - 25°C

2.4W

= 36.5°C/W

In this example, a heat sink with a thermal resistance

of no more than 36.5°C/W must be used to maintain a

junction temperature of no more than 125°C.

THERMAL LIMITING

The MSK 5920RH control circuitry has a thermal shut-

down temperature of approximately 150°C. This ther-

mal shutdown can be used as a protection feature, but

for continuous operation, the junction temperature of the

pass transistor must be maintained below 150°C. Proper

heat sink selection is essential to maintain these condi-

tions.

TYPICAL APPLICATIONS CIRCUIT

R

θSA=

-4.0°C/W - 0.15°C/W

FIGURE 2

Rev. G

1/06

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MSK5920-3.3ERHD Datasheet(PDF) 4 Page - M.S. Kennedy Corporation

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