3

Figure 2. Package Outline Drawing

39.12

(1.540)

MAX.

AREA

RESERVED

FOR

PROCESS

PLUG

12.70

(0.500)

25.40

(1.000)

MAX.

12.70

(0.500)

10.35

(0.407)

MAX.

3.30 ± 0.38

(0.130 ± 0.015)

HFBR-5805

DATE CODE (YYWW)

SINGAPORE

2.92

(0.115)

20.32

(0.800)

[8x(2.54/.100)]

23.55

(0.927)

16.70

(0.657)

0.46

(0.018)

NOTE 1

(9x)

Ø

NOTE 1

0.87

(0.034)

23.24

(0.915)

15.88

(0.625)

NOTE 1: THE SOLDER POSTS AND ELECTRICAL PINS ARE PHOSPHOR BRONZE WITH TIN LEAD OVER NICKEL PLATING.

DIMENSIONS ARE IN MILLIMETERS (INCHES).

+ 0.08

– 0.05

+ 0.003

– 0.002

0.75

(0.030

)

)

6.35

(0.250)

5.93 ± 0.1

(0.233 ± 0.004)

AGILENT

20.32

(0.800)

17.32

(0.682

23.32

(0.918)

18.52

(0.729)

4.14

(0.163

+ 0.25

– 0.05

+ 0.010

– 0.002

1.27

(0.050

Case Temperature

Measurement Point