7

Figure 10. Tape dimensions.

Figure 11. Tape leader and trailer dimensions.

Convective IR Reflow Soldering

For more information on IR

reflow soldering, refer to

Application Note 1060, Surface

Mounting SMT LED Indicator

Components.

Storage Condition: 5 to 30˚ C @ 60% RH max.

Baking is required under the condition:

a) the blue silica gel indicator becoming white/transparent color

b) the pack has been opened for more than 1 week

Baking recommended condition: 60 +/– 5˚C for 20 hours.

8.00 ± 0.30

(0.315 ± 0.012)

USER FEED

DIRECTION

DIM. A

(SEE TABLE 1)

3.50 ± 0.05

(0.138 ± 0.002)

1.75 (0.069)

DIM. C

(SEE TABLE 1)

0.20 ± 0.05

(0.008 ± 0.002)

CARRIER TAPE

COVER TAPE

DIM. B

(SEE TABLE 1)

4.00 (0.157)

2.00 ± 0.05

(0.079 ± 0.002)

4.00 (0.157)

1.50 (0.059)

TABLE 1

DIMENSIONS IN MILLIMETERS (INCHES)

CATHODE

DIM. A

± 0.10 (0.004)

DIM. B

± 0.10 (0.004)

PART NUMBER

DIM. C

± 0.10 (0.004)

HSMx-C191 SERIES

1.80 (0.071)

0.95 (0.037)

0.75 (0.030)

Notes:

1. All dimensions in millimeters (inches).

2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.

END

START

THERE SHALL BE A

MINIMUM OF 160 mm

(6.3 INCH) OF EMPTY

COMPONENT POCKETS

SEALED WITH COVER

TAPE.

MOUNTED WITH

COMPONENTS

THERE SHALL BE A

MINIMUM OF 160 mm

(6.3 INCH) OF EMPTY

COMPONENT POCKETS

SEALED WITH COVER

TAPE.

MINIMUM OF

230 mm

(9.05 INCH)

MAY CONSIST

OF CARRIER

AND/OR

COVER TAPE.