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AP2202K-2.5TR Datasheet(PDF) 5 Page - BCD Semiconductor Manufacturing Limited

Part # AP2202K-2.5TR
Description  150mA RF ULDO REGULATOR
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Manufacturer  BCDSEMI [BCD Semiconductor Manufacturing Limited]
Direct Link  http://www.bcdsemi.com
Logo BCDSEMI - BCD Semiconductor Manufacturing Limited

AP2202K-2.5TR Datasheet(HTML) 5 Page - BCD Semiconductor Manufacturing Limited

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150mA RF ULDO REGULATOR
AP2202
Preliminary Datasheet
5
Aug. 2005 Rev. 1. 3
BCD Semiconductor Manufacturing Limited
Parameter
Symbol
Value
Unit
Supply Input Voltage
VIN
15
V
Enable Input Voltage
VEN
15
V
Power Dissipation
PD
Internally Limited
W
Lead Temperature (Soldering, 5sec)
TLEAD
260
oC
Storage Temperature
TSTG
-65 to 150
oC
ESD (Machine Model)
200
V
Thermal Resistance
θ
JA
(Note 2)
Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated
under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods
may affect device reliability.
Parameter
Symbol
Min
Max
Unit
Supply Input Voltage
VIN
2.5
13.2
V
Enable Input Voltage
VEN
0
13.2
V
Operating Junction Temperature
TJ
-40
125
oC
Recommended Operating Conditions
Note 2: Electrical specifications do not apply when operating the device outside of its operating ratings. The maximum allow-
able power dissipation is a function of the maximum junction temperature, TJ(max), the junction-to-ambient thermal resistance,
θ
JA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated
using: PD(max)=(TJ(max) -TA)/θJA. Exceeding the maximum allowable power dissipation will result in excessive die tempera-
ture, and the regulator will go into thermal shutdown.
Absolute Maximum Ratings (Note 1)


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