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AOD406L Datasheet(PDF) 2 Page - Alpha & Omega Semiconductors

Part # AOD406L
Description  N-Channel Enhancement Mode Field Effect Transistor
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Manufacturer  AOSMD [Alpha & Omega Semiconductors]
Direct Link  http://www.aosmd.com
Logo AOSMD - Alpha & Omega Semiconductors

AOD406L Datasheet(HTML) 2 Page - Alpha & Omega Semiconductors

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background image
AOD406
Symbol
Min
Typ
Max
Units
BVDSS
30
V
0.005
1
TJ=55°C
5
IGSS
100
nA
VGS(th)
0.8
1.1
1.5
V
ID(ON)
100
A
45
TJ=125°C
5.8
7
4.6
5.7
m
gFS
102
S
VSD
0.64
1
V
IS
85
A
Ciss
9130
10500
pF
Coss
625
pF
Crss
387
pF
Rg
0.4
0.5
Qg(4.5V)
72.4
85
nC
Qgs
13.4
nC
Qgd
16.8
nC
tD(on)
14.7
22
ns
tr
14.2
21
ns
tD(off)
105.5
150
ns
tf
23.5
35
ns
trr
30.5
40
ns
Qrr
21
33
nC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE
Gate Drain Charge
VGS=0V, VDS=15V, f=1MHz
SWITCHING PARAMETERS
Total Gate Charge
Gate Source Charge
Gate resistance
VGS=0V, VDS=0V, f=1MHz
VGS=4.5V, VDS=15V, ID=20A
Turn-On Rise Time
Turn-Off DelayTime
VGS=10V, VDS=15V, RL=0.75Ω,
RGEN=3Ω
Turn-Off Fall Time
Turn-On DelayTime
m
VGS=4.5V, ID=20A
IS=1A,VGS=0V
VDS=5V, ID=20A
Maximum Body-Diode Continuous Current
Input Capacitance
Output Capacitance
DYNAMIC PARAMETERS
RDS(ON)
Static Drain-Source On-Resistance
Forward Transconductance
Diode Forward Voltage
IDSS
µA
Gate Threshold Voltage
VDS=VGS ID=250µA
VDS=24V, VGS=0V
VDS=0V, VGS= ±12V
Zero Gate Voltage Drain Current
Gate-Body leakage current
Electrical Characteristics (TJ=25°C unless otherwise noted)
STATIC PARAMETERS
Parameter
Conditions
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge IF=20A, dI/dt=100A/µs
Drain-Source Breakdown Voltage
On state drain current
ID=250µA, VGS=0V
VGS=4.5V, VDS=5V
VGS=10V, ID=20A
Reverse Transfer Capacitance
IF=20A, dI/dt=100A/µs
A: The value of RθJA is measured with the device mounted on 1in
2 FR-4 board with 2oz. Copper, in a still air environment with T
A =25°C. The
Power dissipation PDSM is based on steady-state RθJA and the maximum allowed junction temperature of 150°C. The value in any given
application depends on the user's specific board design, and the maximum temperature fo 175°C may be used if the PCB or heatsink allows it.
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
C: Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C.
D. The R θJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300
µs pulses, duty cycle 0.5% max.
F. These tests are performed with the device mounted on 1 in
2 FR-4 board with 2oz. Copper, in a still air environment with T
A=25°C. The SOA
curve provides a single pulse rating.
G. The maximum current rating is limited by the package current capability. Rev 1: Sept 2005
Alpha & Omega Semiconductor, Ltd.


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