OPA333AIDCKR datasheet(11/18 Pages) BURR-BROWN

Part #	OPA333AIDCKR

Description	1.8V, microPOWER CMOS OPERATIONAL AMPLIFIERS Zer-PI Drift Series

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Manufacturer	BURR-BROWN [Burr-Brown (TI)]

Direct Link	http://www.burr-brown.com

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11 / 18 page

OPA333

OPA2333

SBOS351 − MARCH 2006

www.ti.com

11

DFN PACKAGE

The OPA2333 is offered in an DFN-8 package (also known

as SON). The DFN is a QFN package with lead contacts

on only two sides of the bottom of the package. This

leadless package maximizes board space and enhances

thermal and electrical characteristics through an exposed

pad.

DFN packages are physically small, have a smaller routing

area, improved thermal performance, and improved

electrical parasitics. Additionally, the absence of external

leads eliminates bent-lead issues.

The DFN package can be easily mounted using standard

printed circuit board (PCB) assembly techniques. See

Application Note QFN/SON PCB Attachment (SLUA271)

and Application Report Quad Flatpack No-Lead Logic

Packages (SCBA017), both available for download at

www.ti.com.

The exposed leadframe die pad on the bottom of the

package

should

be

connected

to

V−

or

left

unconnected.

DFN LAYOUT GUIDELINES

The exposed leadframe die pad on the DFN package

should be soldered to a thermal pad on the PCB. A

mechanical drawing showing an example layout is

attached at the end of this data sheet. Refinements to this

layout may be necessary based on assembly process

requirements. Mechanical drawings located at the end of

this data sheet list the physical dimensions for the package

and pad. The five holes in the landing pattern are optional,

and are intended for use with thermal vias that connect the

leadframe die pad to the heatsink area on the PCB.

Soldering

the

exposed

pad

significantly

improves

board-level reliability during temperature cycling, key

push, package shear, and similar board-level tests. Even

with applications that have low-power dissipation, the

exposed pad must be soldered to the PCB to provide

structural integrity and long-term reliability.

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OPA333AIDCKR Datasheet(PDF) 11 Page - Burr-Brown (TI)

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