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OPA333AIDBVRG4 Datasheet(PDF) 11 Page - Burr-Brown (TI) |
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OPA333AIDBVRG4 Datasheet(HTML) 11 Page - Burr-Brown (TI) |
11 / 18 page OPA333 OPA2333 SBOS351 − MARCH 2006 www.ti.com 11 DFN PACKAGE The OPA2333 is offered in an DFN-8 package (also known as SON). The DFN is a QFN package with lead contacts on only two sides of the bottom of the package. This leadless package maximizes board space and enhances thermal and electrical characteristics through an exposed pad. DFN packages are physically small, have a smaller routing area, improved thermal performance, and improved electrical parasitics. Additionally, the absence of external leads eliminates bent-lead issues. The DFN package can be easily mounted using standard printed circuit board (PCB) assembly techniques. See Application Note QFN/SON PCB Attachment (SLUA271) and Application Report Quad Flatpack No-Lead Logic Packages (SCBA017), both available for download at www.ti.com. The exposed leadframe die pad on the bottom of the package should be connected to V− or left unconnected. DFN LAYOUT GUIDELINES The exposed leadframe die pad on the DFN package should be soldered to a thermal pad on the PCB. A mechanical drawing showing an example layout is attached at the end of this data sheet. Refinements to this layout may be necessary based on assembly process requirements. Mechanical drawings located at the end of this data sheet list the physical dimensions for the package and pad. The five holes in the landing pattern are optional, and are intended for use with thermal vias that connect the leadframe die pad to the heatsink area on the PCB. Soldering the exposed pad significantly improves board-level reliability during temperature cycling, key push, package shear, and similar board-level tests. Even with applications that have low-power dissipation, the exposed pad must be soldered to the PCB to provide structural integrity and long-term reliability. |
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