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26B01 Datasheet(PDF) 1 Page - Integrated Circuit Systems

Part # 26B01
Description  LOW SKEW, 1-TO-2 DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER
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Manufacturer  ICST [Integrated Circuit Systems]
Direct Link  http://www.icst.com
Logo ICST - Integrated Circuit Systems

26B01 Datasheet(HTML) 1 Page - Integrated Circuit Systems

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83026BMI-01
www.icst.com/products/hiperclocks.html
REV. A JANUARY 16, 2006
1
Integrated
Circuit
Systems, Inc.
ICS83026I-01
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER
GENERAL DESCRIPTION
The ICS830 26I-01 is a low skew, 1-to-2 Dif-
ferential-to-LVCMOS/LVTTL Fanout Buffer and
a member of the HiPerClock S ™family of
High Perfor mance Clock Solutions from
ICS. The differential input can accept most dif-
ferential signal types (LVPECL, LVDS, LVHSTL, HCSL and
SSTL) and translate to two single-ended LVCMOS/LVTTL out-
puts. The small 8-lead SOIC footprint makes this device ideal
for use in applications with limited board space.
FEATURES
• Two LVCMOS / LVTTL outputs
• Differential CLK, nCLK input pair
• CLK, nCLK pair can accept the following differential
input levels: LVPECL, LVDS, LVHSTL, HCSL, SSTL
• Maximum output frequency: 350MHz
• Output skew: 15ps (maximum)
• Part-to-part skew: 600ps (maximum)
• Additive phase jitter, RMS: 0.03ps (typical)
• Small 8 lead SOIC package saves board space
• 3.3V core, 3.3V, 2.5V or 1.8V output operating supply
• -40°C to 85°C ambient operating temperature
• Available in both standard and lead-free RoHS compliant
packages
BLOCK DIAGRAM
PIN ASSIGNMENT
ICS83026I-01
8-Lead SOIC
3.8mm x 4.8mm, x 1.47mm package body
M Package
Top View
VDD
CLK
nCLK
OE
1
2
3
4
Q0
Q1
CLK
nCLK
OE
HiPerClockS™
ICS
VDDO
Q0
Q1
GND
8
7
6
5
ICS83026I-01
8-Lead TSSOP
4.40mm x 3.0mm x 0.925mm
package body
G Package
Top View
VDD
CLK
nCLK
OE
1
2
3
4
VDDO
Q0
Q1
GND
8
7
6
5


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