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APM2324AC Datasheet(PDF) 9 Page - Anpec Electronics Coropration |
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APM2324AC Datasheet(HTML) 9 Page - Anpec Electronics Coropration |
9 / 10 page Copyright © ANPEC Electronics Corp. Rev. B.3 - Sep., 2005 www.anpec.com.tw 9 APM2324A Carrier Tape & Reel Dimensions t Ao E W Po P Ko Bo D1 D F P1 Table 1. SnPb Entectic Process – Package Peak Reflow Temperature s Package Thickness Volume mm 3 <350 Volume mm 3 ≥350 <2.5 mm 240 +0/-5 °C 225 +0/-5 °C ≥2.5 mm 225 +0/-5 °C 225 +0/-5 °C Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm 3 <350 Volume mm 3 350-2000 Volume mm 3 >2000 <1.6 mm 260 +0 °C* 260 +0 °C* 260 +0 °C* 1.6 mm – 2.5 mm 260 +0 °C* 250 +0 °C* 245 +0 °C* ≥2.5 mm 250 +0 °C* 245 +0 °C* 245 +0 °C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0 °C. For example 260 °C+0°C) at the rated MSL level. Classification Reflow Profiles(Cont.) Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C,5 SEC HOLT MIL-STD 883D-1005.7 1000 Hrs Bias @ 125°C PCT JESD-22-B, A102 168 Hrs, 100% RH, 121°C TST MIL-STD 883D-1011.9 -65°C ~ 150°C, 200 Cycles Reliability Test Program |
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