SG117A/SG117 SERIES

2/93 Rev 1.

2 10/02

Copyright

 1994

11861 Western Avenue

∞

∞

∞

∞

∞ Garden Grove, CA 92841

2

(714) 898-8121

∞

∞

∞

∞

∞ FAX: (714) 893-2570

ELECTRICAL CHARACTERISTICS

(Unless otherwise specified, these specifications apply over full operating ambient temperatures for SG117A/SG117 with -55°C

≤ T

125°C, SG217A/

SG217 with -25°C

≤ T

and IG), and I

(T and L packages). Although power dissipation is internally limited, these specifications are applicable for power dissipations of 2W for the T and L

packages, and 20W for the K, R, and IG packages. I

pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.)

Power Dissipation ........................................

Input to Output Voltage Differential .................................

Storage Temperature Range ..........................

Internally Limited

40V

-65

°C to 150°C

Operating Junction Temperature

Hermetic (K, R, T, L, IG-Packages) ............................

Lead Temperature (Soldering, 10 Seconds) ..............

150

°C

300

°C

Note 1. Exceeding these ratings could cause damage to the device.

Input Voltage Range ..............................

(V

Operating Junction Temperature Range

SG117A/SG117 .........................................

SG217A/SG217 .........................................

SG317A/SG317 ............................................

-55°C to 150°C

-25°C to 150°C

0°C to 125°C

Note 2. Range over which the device is functional.

Note 3. These ratings are applicable for junction temperatures of less than 150°C.

Units

SG117/SG217

Min.

Typ. Max.

Min.

Typ. Max.

SG117A/SG217A

Parameter

Test Conditions

I

T

3V

≤ (V

10mA

≤ I

3V

≤ (V

40V, I

T

T

10mA

≤ I

V

V

V

V

T

V

10V, f =120Hz

C

C

10mA

≤ I

1.238

1.225

66

1.250

1.250

0.005

0.01

5

0.1

20

0.3

0.002

65

80

50

0.2

1.262

1.270

0.01

0.02

15

0.3

50

1

0.02

100

5

1.20

66

1.25

0.01

0.02

5

0.1

20

0.3

0.03

65

80

50

0.2

1.30

0.02

0.05

15

0.3

50

1

0.07

100

5

V

V

%/V

%/V

mV

%

mV

%

%/W

dB

dB

µA

µA

K Package:

θ

3.0°C/W

θ

R Package:

θ

5.0°C/W

θ

40°C/W

T Package:

θ

15°C/W

θ

120°C/W

IG Package:

θ

3.5°C/W

θ

42°C/W

L Package:

θ

35°C/W

θ

120°C/W

THERMAL DATA

Note A. Junction Temperature Calculation: T

J

= T

A

+ (P

D

x

θ

JA

).

Note B. The above numbers for

θ

thermal resistance of the package in a standard mount-

ing configuration. The

θ

guidelines for the thermal performance of the device/pc-

board system. All of the above assume no ambient

airflow.

Reference Voltage

Ripple Rejection

Adjust Pin Current

Adjust Pin Current Change