MRF9030NR1

11

RF Device Data

Freescale Semiconductor

PRODUCT DOCUMENTATION

Refer to the following documents to aid your design process.

Application Notes

• AN1955: Thermal Measurement Methodology of RF Power Amplifiers

Engineering Bulletins

• EB212: Using Data Sheet Impedances for RF LDMOS Devices

REVISION HISTORY

The following table summarizes revisions to this document.

Revision

Date

Description

12

Sept. 2008

• Data sheet revised to reflect part status change, p. 1, including use of applicable overlay.

• Replaced Case Outline 1265-08 with 1265-09, Issue K, p. 1, 8-10. Corrected cross hatch pattern in

bottom view and changed its dimensions (D2 and E3) to minimum value on source contact (D2 changed

from Min-Max .290-.320 to .290 Min; E3 changed from Min-Max .150-.180 to .150 Min). Added JEDEC

Standard Package Number.

• Updated Part Numbers in Table 6, Component Designations and Values, to RoHS compliant part

numbers, p. 3

• Removed Fig. 3, Test Circuit Component Layout (MRF9030NBR1) and Fig. 12, Series Equivalent Source

and Load Impedance (MRF9030NBR1), renumbered Figures accordingly, p. 4-7

• Added Product Documentation and Revision History, p. 11