HCD66765BP datasheet(4/71 Pages) HITACHI

Part #	HCD66765BP

Description	396-channel Segment Driver with Internal RAM for 4096-color Displays

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Manufacturer	HITACHI [Hitachi Semiconductor]

Direct Link	http://www.renesas.com/eng

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HD66765

4

Preliminary

Specification

HD66765 PAD Arrangement

(Top View)

HD66765

Y

X

SEG77

DUMMY1

DUMMY40

DUMMY41

DUMMY42

- Chip size : 13.22mm x 3.85mm

- Chip thickness : 550um (typ.)

- PAD coordinate : PAD center

- Coordinate origine : Chip center

- Au bump size :

(1) 80um x 80 um

DUMMY1, DUMMY2-DUMMY39,

DUMMY40, DUMMY41, DUMMY42

(2) 35um x 80um

SEG304-SEG93

(3) 80um x 35um

SEG386-SEG321,

SEG76-SEG11

(4) 45um x 80um

SEG10-SEG1, SEG396-SEG387,

SEG320-SEG305, SEG92-SEG77

- Au bump pitch : Refer PAD coordinate

- Au bump height : 15um (typ.)

SEG78

SEG94

SEG93

SEG305

SEG306

SEG320

SEG319

SEG304

SEG303

Vcc

GND

CS*

Vcc

GND

VSH

GND

Vcc

VSH

RW/RD*

RS

OSC2

RESET

GNDDUM2

VccDUM1

IM1

IM2

CL1

FLM

DISPTMG

CCL

DCCLK

DB15

RESET

DB14

DB12

DB13

DB11

DB10

DB9

GNDDUM1

DB8

DB7

DB6

DB5

DB3

DB4

DB2

DB0/SDI

DB1/SDO

E/WR*/SCL

GND

OSC1

IM0/ID

TEST

M

CCS

CDA

SEG92

SEG91

SEG1

SEG2

SEG9

SEG10

SEG387

SEG388

SEG395

SEG396

DUMMY17

DUMMY16

DUMMY3

DUMMY2

DUMMY39

DUMMY38

DUMMY19

DUMMY18

No.1

No.2

No.500

No.434

No.435

No.433

No.122

No.123

No.121

No.189

No.188

No.190

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HCD66765BP Datasheet(PDF) 4 Page - Hitachi Semiconductor

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