Design, Specifications are subject to change without notice.

Ask factory for technical specifications before purchase and/or use.

Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.

ERJ1G(0201)

0.3 to 0.4

0.8 to 0.9 0.25 to 0.35

ERJ2G(0402)

0.5 to 0.6

1.4 to 1.6

0.4 to 0.6

ERJ3G(0603)

0.7 to 0.9

2 to 2.2

0.8 to 1

ERJ6G(0805)

1 to 1.4

3.2 to 3.8

0.9 to 1.4

2 to 2.4

4.4 to 5

1.2 to 1.8

ERJ14(1210)

2 to 2.4

4.4 to 5

1.8 to 2.8

ERJ12(1812)

3.3 to 3.7

5.7 to 6.5

2.3 to 3.5

ERJ12Z(2010)

3.6 to 4

6.2 to 7

1.8 to 2.8

ERJ1T(2512)

5 to 5.4

7.6 to 8.6

2.3 to 3.5

Thick Film Chip Resistors

Chip Resistor

a

b

Type

(inches)

Dimensions (mm)

ab

c

Recommendations and precautions are described below.

Preheating

Peak

Heating

Time

l Recommended soldering conditions for reflow

Temperature

Time

Preheating

140 ¡C to 160 ¡C

60 s to 120 s

Main heating

Above 200 ¡C

30 s to 40 s

Peak

235 ± 5 ¡C

max. 10 s

Temperature

Time

Preheating

150 ¡C to 180 ¡C

60 s to 120 s

Main heating

Above 230 ¡C

30 s to 40 s

Peak

max. 260 ¡C

max. 10 s

l Recommended soldering conditions for flow

Temperature

Time

Temperature

Time

Preheating

140 ¡C to 160 ¡C

60 s to 120 s

150 ¡C to 180 ¡C

60 s to 120 s

Soldering

245±5 ¡C

20 s to 30 s

max. 260 ¡C

max. 10 s

In case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount

properly. Generally, the land width should be 0.7 to 0.8 times the width of chip the resistor. In case of reflow soldering,

ERJ8G(1206)

solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).

áReflow soldering should be a maximum of two times

áPlease contact us for additional information when

used in conditions other than those specified.

every type of printed circuit board for solderability, before

actual use.

For soldering (Example : Sn/Pb)

For lead-free soldering (Example : Sn/Ag/Cu)

For soldering

For lead-free soldering

Safety Precautions

confirmation test with the resistors actually mounted on the board.

When a load of more than the rated power is applied under load condition at steady state, it may

Never exceed the specified rated power.

2. Chlorine type or other highly-reactive flux is not recommended. Residue could affect performance or reliability of

the resistors.

impair performance and/or reliability of the resistor.

3. When using a soldering iron, never let the tip of the iron touch the body of the chip resistor. When using a

soldering iron with a tip at a high temperature, solder for as short time as possible (no more than three seconds

and up to 350 ¡C).

4. Avoid physical shock to the resistor and nipping of the resistor with hard tool (pliers or tweezers) as it may

damage the protective coating of the resistor and may affect its performance.

1. If transient load (heavy load in a short time) like pulse is to be applied, carry out an evaluation and

áPlease measure the temperature of terminations and study