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ERJ2GEYJC Datasheet(PDF) 4 Page - Panasonic Semiconductor |
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ERJ2GEYJC Datasheet(HTML) 4 Page - Panasonic Semiconductor |
4 / 4 page Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. ERJ1G(0201) 0.3 to 0.4 0.8 to 0.9 0.25 to 0.35 ERJ2G(0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 ERJ3G(0603) 0.7 to 0.9 2 to 2.2 0.8 to 1 ERJ6G(0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4 2 to 2.4 4.4 to 5 1.2 to 1.8 ERJ14(1210) 2 to 2.4 4.4 to 5 1.8 to 2.8 ERJ12(1812) 3.3 to 3.7 5.7 to 6.5 2.3 to 3.5 ERJ12Z(2010) 3.6 to 4 6.2 to 7 1.8 to 2.8 ERJ1T(2512) 5 to 5.4 7.6 to 8.6 2.3 to 3.5 Thick Film Chip Resistors n Recommended Land Pattern Chip Resistor a b Type (inches) Dimensions (mm) ab c n Recommended Soldering Conditions Recommendations and precautions are described below. Preheating Peak Heating Time l Recommended soldering conditions for reflow Temperature Time Preheating 140 ¡C to 160 ¡C 60 s to 120 s Main heating Above 200 ¡C 30 s to 40 s Peak 235 ± 5 ¡C max. 10 s Temperature Time Preheating 150 ¡C to 180 ¡C 60 s to 120 s Main heating Above 230 ¡C 30 s to 40 s Peak max. 260 ¡C max. 10 s l Recommended soldering conditions for flow Temperature Time Temperature Time Preheating 140 ¡C to 160 ¡C 60 s to 120 s 150 ¡C to 180 ¡C 60 s to 120 s Soldering 245±5 ¡C 20 s to 30 s max. 260 ¡C max. 10 s In case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount properly. Generally, the land width should be 0.7 to 0.8 times the width of chip the resistor. In case of reflow soldering, ERJ8G(1206) solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W). áReflow soldering should be a maximum of two times áPlease contact us for additional information when used in conditions other than those specified. every type of printed circuit board for solderability, before actual use. For soldering (Example : Sn/Pb) For lead-free soldering (Example : Sn/Ag/Cu) For soldering For lead-free soldering Safety Precautions confirmation test with the resistors actually mounted on the board. When a load of more than the rated power is applied under load condition at steady state, it may Never exceed the specified rated power. 2. Chlorine type or other highly-reactive flux is not recommended. Residue could affect performance or reliability of the resistors. impair performance and/or reliability of the resistor. 3. When using a soldering iron, never let the tip of the iron touch the body of the chip resistor. When using a soldering iron with a tip at a high temperature, solder for as short time as possible (no more than three seconds and up to 350 ¡C). 4. Avoid physical shock to the resistor and nipping of the resistor with hard tool (pliers or tweezers) as it may damage the protective coating of the resistor and may affect its performance. 1. If transient load (heavy load in a short time) like pulse is to be applied, carry out an evaluation and áPlease measure the temperature of terminations and study |
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