K7N323645M

- 1 -

Rev 2.0

Nov. 2003

K7N321845M

Document Title

The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the

specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-

tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.

Revision History

Rev. No.

0.0

0.1

0.2

0.3

0.4

0.5

1.0

1.1

2.0

Remark

Preliminary

Preliminary

Preliminary

Preliminary

Preliminary

Preliminary

Final

Final

Final

History

1. Initial document.

1. Add 165FBGA package

1.Update JTAG scan order

2. Speed bin merge.

From K7N3236(18)49M to K7N3236(18)45M

3. AC parameter change.

tOH(min)/tLZC(min) from 0.8 to 1.5 at -25

tOH(min)/tLZC(min) from 1.0 to 1.5 at -22

tOH(min)/tLZC(min) from 1.0 to 1.5 at -20

1. Change pin out for 165FBGA

- x18/x36 ;

11B => from A to NC

,

2R ==> from NC to A

1. Insert pin at JTAG scan order of 165FBGA in connection with

pin out change

- x18/x36 ;

insert Pin ID of 2R to BIT number of 69

1. Add Icc, Isb, Isb1 and Isb2 values.

1. Final datasheet release.

1. Change the Stand-by current (Isb)

Before

After

Isb - 25 :

120

170

- 22 :

110

160

- 20 :

100

150

- 16 :

90

140

- 15 :

90

140

- 13 :

90

140

Isb1

:

90

110

Isb2

:

80

100

1. Delete the 119BGA package

2. Delete the 225MHz and 150MHz speed bin

Draft Date

May. 10. 2001

Aug. 29. 2001

Dec. 31. 2001

Feb. 14. 2002

Apr. 20. 2002

May. 10. 2002

Sep. 26. 2002

Oct. 17, 2003

Nov. 18, 2003