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phone: 949-709-5075 / fax: 949-709-3536
Specifications subject to change without notice
Revision: 4/20/04 I
OS11
Part Numbering Guide
*See page VA4 for Tape Specifications
**Not available in 2.5V and 1.8V
*** Available to 70MHz only
**** Available to 40MHz only
Mechanical Dimensions
Markings
Line 1: MMD “Date Code”
Line 2: Frequency
Environmental / Mechanical
Shock: MIL-STD-883, Method 2002, Condition B
Solderability: MIL-STD-883, Method 2003
Solvent Resistance: MIL-STD-202, Method 215
Vibration: MIL-STD-883, Method 2007, Condition A
Gross Leak Test: MIL-STD-883, Method 1014, Condition C
Fine Leak Test: MIL-STD-883, Method 1014, Condition A2
Pad Connections
Suggested Solder Pad Layout
Pin 1: Tri-State
Pin 2: Ground / Case
Pin 3: Output
Pin 4: Supply Voltage
1.7 max
.067 max
Markings
1
2
3
4
1
2
4
3
7.0 ±0.2
.278 ±.008
5.08 ±0.15
.200 ±.006
3.68 ±0.15
.145 ±.006
1.4 ±0.1
.055 ±.004
Solder Pad
(X4)
2.88
.113
2.2
.087
Tri-state Operation
Logic 1 or NC = Oscillation
Logic 0 or GND = High Impedance
Frequency
MI
Frequency Stability
100 = ±100ppm
050 = ±50ppm
025 = ±25ppm
020 = ±20ppm
015 = ±15ppm
010 = ±10ppm**
Supply Voltage
Blank = 5 Volt
3 = 3.3 Volt
2 = 2.5 Volt***
1 = 1.8 Volt****
Output
H = HCMOS
T&R
Operating Temperature
Blank = 0°C to 70°C
27 = -20°C to 70°C**
48 = -40°C to 85°C**
Packaging*
Blank = Bulk
T&R = Tape and Reel
Pin 1 Connection
H = Tri-state
5X7 Ceramic SMD
Symmetry
Blank = 40%/60%
A = 45%/55%
H
H
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