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MAX9129EGE Datasheet(PDF) 8 Page - Maxim Integrated Products |
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MAX9129EGE Datasheet(HTML) 8 Page - Maxim Integrated Products |
8 / 13 page The reduction in characteristic impedance is approxi- mated by the following formula: ZDIFF-loaded = ZDIFF-unloaded ✕ SQRT [Co / (Co + N ✕ CL / L)] where: ZDIFF-unloaded = unloaded differential characteristic im- pedance Co = unloaded trace capacitance (pF/unit length) CL = value of each capacitive load (pF) N = number of capacitive loads L = trace length For example, if Co = 2.5pF/in, CL = 10pF, N = 18, L = 18in, and ZDIFF-unloaded = 120 Ω, the loaded differential impedance is: ZDIFF-loaded = 120 Ω ✕ SQRT [2.5pF / (2.5pF + 18 ✕ 10pF/18in)] ZDIFF-loaded = 54 Ω In this example, capacitive loading reduces the charac- teristic impedance from 120 Ω to 54Ω. The load seen by a driver located on a card in the middle of the bus is 27 Ω because the driver sees two 54Ω loads in parallel. A typical LVDS driver (rated for a 100 Ω load) would not develop a large enough differential signal to be reliably detected by an LVDS receiver. Maxim’s BLVDS driver is designed and specified to drive a 27 Ω load to differen- tial voltage levels of 250mV to 450mV (which are stan- dard LVDS driver levels). A standard LVDS receiver is able to detect this level of differential signal. Short extensions off the bus, called stubs, contribute to capacitive loading. Keep stubs less than 1in for a good balance between ease of component placement and good signal integrity. The MAX9129 is a current source driver and drives larger differential signal levels into loads higher than 27 Ω and smaller levels into loads less than 27Ω (see typical operating curves). To keep loading from reduc- ing bus impedance below the rated 27 Ω load, PC board traces can be designed for higher unloaded characteristic impedance. Effect of Transition Time For transition times (measured from 0% to 100%) short- er than the delay between capacitive loads, the loads are seen as low-impedance discontinuities from which the driven signal is reflected. Reflections add and sub- tract from the signal being driven and cause decreased noise margin and jitter. The MAX9129 is designed for a minimum transition time of 1ns (rated 0.6ns from 20% to 80%, or about 1ns 0% to 100%) to reduce reflections while being fast enough for high-speed backplane data transmission. Power-On Reset The power-on reset voltage of the MAX9129 is typically 2.25V. When the supply falls below this voltage, the device is disabled and the outputs are in high imped- ance. Applications Information Power-Supply Bypassing Bypass VCC with high-frequency, surface-mount ceramic 0.1µF and 0.001µF capacitors in parallel as close to the device as possible, with the smaller valued capacitor closest to VCC. Termination In the example above, the loaded differential imped- ance of the bus is reduced to 54 Ω. Since it can be dri- ven from any card position, the bus must be terminated at each end. A parallel termination of 54 Ω at each end of the bus placed across the traces that make up the differential pair provides a proper termination. The total load seen by the driver is 27 Ω. The MAX9129 drives higher differential signal levels into lighter loads. A multidrop bus with the driver at one end and receivers connected at regular intervals along the bus has a lowered impedance due to capacitive loading. Assuming the same impedance calculated in the multidrop example above (54 Ω), the multidrop bus can be terminated with a single, parallel-connected 54 Ω resistor at the far end from the driver. Only a single resistor is required because the driver sees one 54 Ω differential trace. The signal swing is larger with a 54 Ω load. In general, parallel terminate each end of the bus with a resistor matching the differential impedance of the bus (taking into account any reduced impedance due to loading). Board Layout A four-layer PC board that provides separate power, ground, input, and output signals is recommended. Keep the LVTTL/LVCMOS and BLVDS signals separat- ed to prevent coupling as shown in the suggested lay- out for the QFN package (not drawn to scale) (Figure 6). Quad Bus LVDS Driver with Flow-Through Pinout 8 _______________________________________________________________________________________ |
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