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K5D5657DCM-F0CL Datasheet(PDF) 2 Page - Samsung semiconductor |
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K5D5657DCM-F0CL Datasheet(HTML) 2 Page - Samsung semiconductor |
2 / 74 page K5D5657DCM-F015 Revision 0.0 June 2003 - 2 - MCP MEMORY Preliminary Document Title Multi-Chip Package MEMORY 256M Bit(32Mx8) Nand Flash / 256M Bit(4Mx16x4Banks) Mobile SDRAM Revision History The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have any questions, please contact the SAMSUNG branch office near you. Revision No. 0.0 Remark Preliminary History Initial issue. (256Mb NAND C-Die_Ver 1.0) (256Mb MSDRAM E‘-Die_Ver 0.5) Draft Date June 23, 2003 Note : For more detailed features and specifications including FAQ, please refer to Samsung’s web site. http://samsungelectronics.com/semiconductors/products/products_index.html |
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