NL27WZ126

http://onsemi.com

8

PACKAGE DIMENSIONS

DIM

A

MIN

MAX

MIN

MAX

INCHES

1.90

2.10

0.075

0.083

MILLIMETERS

B

2.20

2.40

0.087

0.094

C

0.60

0.90

0.024

0.035

D

0.17

0.25

0.007

0.010

F

0.20

0.35

0.008

0.014

G

0.50 BSC

0.020 BSC

H

0.40 REF

0.016 REF

J

0.10

0.18

0.004

0.007

K

0.00

0.10

0.000

0.004

L

3.00

3.20

0.118

0.126

M

0

6

0

6

N

5

10

5

10

P

0.28

0.44

0.011

0.017

R

0.23

0.33

0.009

0.013

S

0.37

0.47

0.015

0.019

U

0.60

0.80

0.024

0.031

V

0.12 BSC

0.005 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS

3. DIMENSION A" DOES NOT INCLUDE MOLD

FLASH, PROTRUSION OR GATE BURR. MOLD

FLASH. PROTRUSION AND GATE BURR SHALL

NOT EXCEED 0.140 MM (0.0055") PER SIDE.

4. DIMENSION B" DOES NOT INCLUDE

INTER-LEAD FLASH OR PROTRUSION.

INTER-LEAD FLASH AND PROTRUSION SHALL

NOT E3XCEED 0.140 (0.0055") PER SIDE.

5. LEAD FINISH IS SOLDER PLATING WITH

THICKNESS OF 0.0076-0. 0203 MM. (300-800

INCH).

6. ALL TOLERANCE UNLESS OTHERWISE

SPECIFIED ±0.0508 (0.0002").

L

B

A

P

G

4

1

5

8

C

K

D

SEATING

J

S

R

U

DETAIL E

V

F

H

N

R 0.10 TYP

M

–Y–

–X–

–T–

DETAIL E

T

M

0.10 (0.004)

XY

T

0.10 (0.004)

__

__

__

__

PLANE

US8

US SUFFIX

CASE 493–01

ISSUE O

3.8

1.8 TYP

1.0

0.3 TYP

0.5 TYP

(mm)

ON Semiconductor and

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changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any

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liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or

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PUBLICATION ORDERING INFORMATION

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4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031

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For additional information, please contact your local

Sales Representative.

NL27WZ126/D

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