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BUF602ID Datasheet(PDF) 2 Page - Texas Instruments |
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BUF602ID Datasheet(HTML) 2 Page - Texas Instruments |
2 / 22 page www.ti.com ABSOLUTE MAXIMUM RATINGS (1) Top View 1 2 3 5 4 Out −V CC V REF +V CC In AWO Pin Orientation/Package Marking SOT23−5 x1 x1 200 Ω 50k Ω 50k Ω 1 2 3 4 8 7 6 5 +V CC NC NC In Out NC V REF −V CC SO−8 NC = No Connection x1 x1 200 Ω 50k Ω 50k Ω BUF602 SBOS339 – OCTOBER 2005 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) SPECIFIED PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT MEDIA, PRODUCT PACKAGE DESIGNATOR RANGE MARKING NUMBER QUANTITY BUF602ID Rails, 75 BUF602 SO-8 D –45 °C to +85°C BUF602 BUF602IDR Tape and Reel, 2500 BUF602IDBVT Tape and Reel, 250 BUF602 SOT23-5 DBV –45 °C to +85°C AWO BUF602IDBVR Tape and Reel, 3000 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document or see the TI web site at www.ti.com. Power Supply ±6.5V DC Internal Power Dissipation See Thermal Information Input Common-Mode Voltage Range ±V S Storage Temperature Range: D, DBV –40 °C to +125°C Lead Temperature (soldering, 10s) +300 °C Junction Temperature (TJ) +150 °C ESD Rating: Human Body Model (HBM) 2000V Charge Device Model (CDM) 1000V Machine Model (MM) 200V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. 2 |
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