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Rev 3.0

Nov. 2003

K7M161825A

K7M163625A

Document Title

The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the

specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-

tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.

Revision History

Rev. No.

0.0

0.1

0.2

0.3

1.0

2.0

2.1

3.0

Remark

Preliminary

Preliminary

Preliminary

Preliminary

Final

Final

Final

Final

History

1. Initial document.

1. Add JTAG Scan Order

1. Remove bin -90

2. Updated DC characteristics(ICC,ISB,ISB1,ISB2)

1. Add x32 org and industrial temperature .

2. Add 165FBGA package

1. Final spec release

1. Add the speed bin (-60)

1. Delete 119BGA package.

2. Correct the Ball Size of 165 FBGA.

1. Delete x32 Org. and 165FBGA pkg. type.

2. Delete the 6.0ns and 8.5ns speed bin

Draft

Date

Feb. 23. 2001

May. 10. 2001

Aug. 03. 2001

Aug. 30. 2001

May. 10. 2002

Oct. 26, 2002

April. 04. 2003

Nov. 17, 2003