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AD9445BSVZ-125 Datasheet(PDF) 8 Page - Analog Devices |
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AD9445BSVZ-125 Datasheet(HTML) 8 Page - Analog Devices |
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8 / 40 page  AD9445 Rev. 0 | Page 8 of 40 ABSOLUTE MAXIMUM RATINGS Table 5. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. With Respect To Parameter Rating ELECTRICAL AVDD1 AGND −0.3 V to +4 V AVDD2 AGND −0.3 V to +6 V DRVDD DGND −0.3 V to +4 V AGND DGND −0.3 V to +0.3 V THERMAL RESISTANCE AVDD1 DRVDD −4 V to +4 V The heat sink of the AD9445 package must be soldered to ground. AVDD2 DRVDD −4 V to +6 V AVDD2 AVDD1 −4 V to +6 V Table 6. D0± to D13± DGND –0.3 V to DRVDD + 0.3 V Package Type θJA θJB θJC Unit CLK+/CLK− AGND –0.3 V to AVDD1 + 0.3 V 100-lead TQFP/EP 19.8 8.3 2 °C/W AGND –0.3 V to AVDD1 + 0.3 V OUTPUT MODE, DCS MODE, DFS, SFDR, RF ENABLE Typical θJA = 19.8°C/W (heat sink soldered) for multilayer board in still air. VIN+, VIN− AGND –0.3 V to AVDD2 + 0.3 V VREF AGND –0.3 V to AVDD1 + 0.3 V Typical θJB = 8.3°C/W (heat sink soldered) for multilayer board in still air. SENSE AGND –0.3 V to AVDD1 + 0.3 V REFT, REFB AGND –0.3 V to AVDD1 + 0.3 V Typical θJC = 2°C/W (junction to exposed heat sink) represents the thermal resistance through heat sink path. ENVIRONMENTAL –65°C to +125°C Storage Temperature Range Airflow increases heat dissipation, effectively reducing θJA. Also, more metal directly in contact with the package leads from metal traces through holes, ground, and power planes reduces the θJA. It is required that the exposed heat sink be soldered to the ground plane. –40°C to +85°C Operating Temperature Range 300°C Lead Temperature (Soldering 10 sec) Junction Temperature 150°C ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. |
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