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UPD16704 Datasheet(PDF) 3 Page - NEC |
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UPD16704 Datasheet(HTML) 3 Page - NEC |
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3 / 14 page  Data Sheet S15809EJ1V0DS 3 µµµµ PD16704 2. PIN CONFIGURATION (IC Pad Surface) Chip Size: 1.06 x 15.39 mm 2 Remark This figure does not specify the TCP package. Dummy Dummy VDD2 VDD2 VDD2 Alignment Mark Dummy TEST1 O1 TEST1 O2 VEE2 VEE2 VEE2 VEE2 VEE1 VEE1 VEE1 VEE1 Dummy VDD1 VDD1 VDD1 VDD1 DS DS R/L R/L STV STV CLK CLK Dummy Dummy OE OE DSO E DSO E VSS VSS VSS VSS VCC VCC VCCC VCCC Dummy VEE1 VEE1 VEE1 VEE1 VEE2 VEE2 VEE2 O239 VEE2 O240 TEST2 Dummy TEST2 Alignment Mark Dummy Dummy VDD2 VDD2 VDD2 0 X(+) Y(+) • Bump size : 40 x 80 µm2 : 110 x 60 µm2 • Alignment : 50 x 50 µm2 Alignment Mark Coordinate (Unit: mm): (7570, 405) , ( −7570, 405) |
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Similar Description - UPD16704 |
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