© 2004 California Micro Devices Corp. All rights reserved.

08/16/04

430 N. McCarthy Blvd., Milpitas, CA 95035-5112

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Tel: 408.263.3214

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Fax: 408.263.7846

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www.calmicro.com

3

CM3065

PRELIMINARY

Specifications

Note 1: The SOIC package used is thermally enhanced through the use of a fused integral leadframe. The power rating is based on

a printed circuit board heat spreading capability equivalent to 2 square inches of copper connected to the GND pins. Typical

multi-layer boards using power plane construction will provide this heat spreading ability without the need for additional ded-

icated copper area. (Please consult with factory for thermal evaluation assistance)

ABSOLUTE MAXIMUM RATINGS

PARAMETER

RATING

UNITS

ESD Protection (HBM)

±2000

V

Pin Voltages

IN, OUT, ADJ, EN

[GND - 0.4] to +6.0

V

Storage Temperature Range

-40 to +150

°C

Operating Temperature Range

Ambient

Junction

-40 to +85

-40 to +150

°C

°C

Power Dissipation (See note 1)

Internally Limited

W

STANDARD OPERATING CONDITIONS

PARAMETER

VALUE

UNITS

2.2 to 5.5

V

Ambient Operating Temperature Range

-40 to +85

°C

Load Current

0 to 2000

mA

10

±20%

µF